A New Architecture for the Next Generation of Bluetooth® Audio
LE Audio introduces an entirely new architecture for supporting audio applications using Bluetooth technology and sets the stage for the next 20 years of innovation in wireless audio. This page provides an overview of the Bluetooth Specifications that define LE Audio.
The Bluetooth Specifications that define LE Audio
| Specification | Description | ||
|---|---|---|---|
|
The Bluetooth Core Specification was enhanced in December 2019 to enable delivery of audio over Bluetooth LE, including a new LE Isochronous Channels feature. |
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A new specification released in September 2020 that defines a high-quality, low-power audio codec. |
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|
Generic Audio Framework Specifications |
A set of new specifications that define a flexible middleware for transmitting and controlling audio over Bluetooth LE. |
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|
Stream Management PACS: Published Audio Capabilities Service |
A set of new specifications that define basic interoperability for audio devices, including capability discovery and configuration of unicast and broadcast audio streams. |
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|
Media Control |
A set of new specifications that define media control. |
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|
Call Control |
A set of new specifications that define call control for all types of telephony. |
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|
Common Audio |
A set of new specifications that defines the application of isochronous audio streams with multiple devices in multi-service situations, along with the integration of media and volume controls. |
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|
Coordinated Devices |
A set of new specifications that define how to identify and treat devices as part of a coordinated set. (e.g., true wireless earbuds, home stereo speakers). |
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Microphone Control |
A set of new specifications that define microphone control. |
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Volume Control |
A set of new specifications that define volume control and balance. |
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|
Use Case Profiles |
A set of new specifications that define interoperable support for existing and new audio use cases based on LE Audio. |
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|
A new specification that defines global, interoperable support for telephony and media audio, replicating and extending the two primary use cases for Bluetooth Classic Audio today. |
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A new set of specifications that define global, interoperable support for Bluetooth audio on hearing assistance devices such as hearing aids and associated hearing reinforcement solutions. |
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A new specification that defines global, interoperable support for broadcast audio use cases such as public address systems and televisions. |
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LE Audio Specification Participants
We are grateful for all the time and energy you dedicated to the LE Audio Specification Project. Your participation and collaboration are greatly appreciated, and your hard work will have a big impact on wireless audio for decades to come.
Fraunhofer IIS
Synopsys, Inc.
Sony Corporation
Starkey Hearing Technologies
Fraunhofer IIS
Samsung Electronics Co., Ltd
Sony Corporation
Broadcom Corporation
MindTree Limited
Nordic Semiconductor ASA
Intel Corporation
Demant A/S
Oticon A/S
Qualcomm, Inc.
Microchip
Cloud2GND
Intel Corporation
Qualcomm, Inc.
ON Semiconductor
Dolby Labs
Dolby Laboratories, Inc.
Samsung Cambridge Solution Centre
Nordic Semiconductor ASA
Bose Corporation
Broadcom
Oppo
Nordic Semiconductor ASA
Microchip
Fraunhofer IIS
Plantronics Inc.
Apple Inc.
Texas Instruments Incorporated
Microsoft Corporation
RivieraWaves
Sonova AG
Codecoup
Nordic Semiconductor ASA
Intel Corporation
Cirrus Logic
Sony Corporation
Sony Corporation
Intel Corporation
LG Electronics, Inc.
Fraunhofer IIS
Widex A/S
ARM Ltd
Packetcraft, Inc.
RivieraWaves
Starkey Hearing Technologies
ARM Ltd
ON Semiconductor
LG Electronics
Qualcomm, Inc.
Sivantos GmbH
ARM Ltd
Packetcraft, Inc.
Ericsson AB
Qualcomm, Inc.
Widex A/S
WS Audiology
WS Audiology Denmark A/S
Meta Platforms, Inc.
Synopsys, Inc.
Synopsys, Inc.
Synopsys, Inc.
MediaTek
Synopsys, Inc.
Nordic Semiconductor ASA
Hisilicon Technologies Co., Ltd.
Intel Corporation
Codecoup
Intel Corporation
Synopsys, Inc.
Intel Corporation
GN Hearing A/S
Fraunhofer IIS
Ericsson AB
Sony Corporation
Sony Corporation
Fraunhofer IIS
Qualcomm, Inc.
Bose Corporation
Widex A/S
Cypress Semiconductor Corporation
ARM Ltd.
Sonos
GN Hearing A/S
GN Resound
Samsung Electronics Co., Ltd.
Intel Corporation
Nordic Semiconductor ASA
Intel Corporation
Bose Corporation
Barrot Technology Limited
Cypress Semiconductor Corporation
Bose Corporation
Samsung Electronics Co., Ltd.
Sivantos GmbH
WS Audiology Denmark A/S
Sivantos GmbH
Intel Corporation
Qualcomm, Inc.
Cypress Semiconductor Corporation
Cypress Semiconductor Corporation
NXP Semiconductors
Plantronics, Inc., Poly
Broadcom Corporation
Broadcom Corporation
Mindtree
Apple, Inc.
LG Electronics, Inc.
Widex A/S
Sivantos GmbH
Sonova AG
LG Electronics
GN Hearing A/S
Bose Corporation
Ericsson AB
T2labs-LLC
Intel Corporation
Barrot Technology Limited
LE Audio IOP Participants
Barrot
Broadcom Corporation
Broadcom Corporation
Bose
Broadcom Corporation
Broadcom Corporation
Broadcom Corporation
Codecoup sp. z o.o.
Codecoup sp. z o.o.
Codecoup sp. z o.o.
Codecoup sp. z o.o. sp. k.
GN Hearing A/S
GN Hearing A/S
GN Hearing A/S
Infineon Technologies AG
Infineon Technologies AG
Infineon Technologies AG
Intel
Intel
Intel
Intel
Intel
Intel
Intel
Intel
Microchip
Microchip
MindTree Limited
NXP
Qualcomm, Inc.
Qualcomm, Inc.
Qualcomm, Inc.
Qualcomm, Inc.
Qualcomm, Inc.
Qualcomm, Inc.
Qualcomm, Inc.
Qualcomm, Inc.
Qualcomm, Inc.
Qualcomm, Inc.
Qualcomm, Inc.
Qualcomm, Inc.
Qualcomm, Inc.
Qualcomm, Inc.
Qualcomm, Inc.
Qualcomm, Inc.
Qualcomm, Inc.
Qualcomm, Inc.
Realsil
Realsil
CEVA – RivieraWaves
Codecoup sp. z o.o.
MindTree Limited
MindTree Limited
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