A New Architecture for the Next Generation of Bluetooth® Audio

LE Audio introduces an entirely new architecture for supporting audio applications using Bluetooth technology and sets the stage for the next 20 years of innovation in wireless audio. This page provides an overview of the Bluetooth Specifications that define LE Audio.

The Bluetooth Specifications that define LE Audio

Specification Description

Bluetooth Core Specification

The Bluetooth Core Specification was enhanced in December 2019 to enable delivery of audio over Bluetooth LE, including a new LE Isochronous Channels feature.

LC3: Low Complexity Communications Codec

A new specification released in September 2020 that defines a high-quality, low-power audio codec.

Generic Audio Framework Specifications

A set of new specifications that define a flexible middleware for transmitting and controlling audio over Bluetooth LE.

 

Stream Management

BAP: Basic Audio Profile

PACS: Published Audio Capabilities Service

ASCS: Audio Stream Control Service

BASS: Broadcast Audio Scan Service

A set of new specifications that define basic interoperability for audio devices, including capability discovery and configuration of unicast and broadcast audio streams.

 

Media Control

MCP: Media Control Profile

MCS: Media Control Service

A set of new specifications that define media control.

 

Call Control

CCP: Call Control Profile

TBS: Telephone Bearer Service

A set of new specifications that define call control for all types of telephony.

 

Common Audio

CAP: Common Audio Profile

CAS: Common Audio Service

A set of new specifications that defines the application of isochronous audio streams with multiple devices in multi-service situations, along with the integration of media and volume controls.

 

Coordinated Devices

CSIP: Coordinated Set Identification Profile

CSIS: Coordinated Set Identification Service

A set of new specifications that define how to identify and treat devices as part of a coordinated set. (e.g., true wireless earbuds, home stereo speakers).

 

Microphone Control

MICP: Microphone Control Profile

MICS: Microphone Control Service

A set of new specifications that define microphone control.

 

Volume Control

VCP: Volume Control Profile

VCS: Volume Control Service

VOCS: Volume Offset Control Service

AICS: Audio Input Control Service

A set of new specifications that define volume control and balance.

Use Case Profiles

A set of new specifications that define interoperable support for existing and new audio use cases based on LE Audio.

 

TMAP: Telephony and Media Audio Profile

A new specification that defines global, interoperable support for telephony and media audio, replicating and extending the two primary use cases for Bluetooth Classic Audio today.

 

HAP: Hearing Access Profile

HAS: Hearing Access Service

A new set of specifications that define global, interoperable support for Bluetooth audio on hearing assistance devices such as hearing aids and associated hearing reinforcement solutions.

 

PBP: Public Broadcast Profile

A new specification that defines global, interoperable support for broadcast audio use cases such as public address systems and televisions.

LE Audio Specification Participants

We are grateful for all the time and energy you dedicated to the LE Audio Specification Project. Your participation and collaboration are greatly appreciated, and your hard work will have a big impact on wireless audio for decades to come .

Alevx Volkov
Starkey Hearing Technologies
Alexander Tschekalinskij
Fraunhofer IIS
Andrew Credland
Samsung Electronics Co., Ltd
Andrew Estrada
Sony Corporation
Angel Polo
Broadcom Corporation
Anil Kumar Vutukuru
MindTree Limited
Asbjørn Sæbø
Nordic Semiconductor ASA
Balvinder Pal Singh
Intel Corporation
Bjarne Klemmensen
Demant A/S, Oticon A/S
Brian Redding
Qualcomm, Inc.
Charlie Lee
Microchip
Charlie Lenahan
Cloud2GND
Chethan Narayan Tumkur
Intel Corporation
Chris Church
Qualcomm, Inc.
Chris Deck
ON Semiconductor
Chris White
Dolby Labs, Dolby Laboratories, Inc.
Clive D. W. Feather
Samsung Cambridge Solution Centre
Daniel Ryan
Nordic Semiconductor ASA
Daniel Sisolak
Bose Corporation
David Hughes
Broadcom
Dong Jianli
Oppo
Eivind Sjøgren Olsen
Nordic Semiconductor ASA
Ella Chu
Microchip
Emmanuel Ravelli
Fraunhofer IIS
Erwin Weinans
Plantronics Inc.
Ethan Duni
Apple Inc.
Florian Lefeuvre
Texas Instruments Incorporated
Frank Yerrace
Microsoft Corporation
Frederic Belouin
RivieraWaves
Georg Dickmann
Sonova AG
Grzegorz Kołodziejczyk
Codecoup
Håkon Amundsen
Nordic Semiconductor ASA
Harish Balasubramaniam
Intel Corporation
Harpreet Narula
Cirrus Logic
Haruhiko Kaneko
Sony Corporation
Hidetoshi Kurihara
Sony Corporation
HJ Lee
LG Electronics, Inc.
Jan Büthe
Fraunhofer IIS
Jannik Andersen
Widex A/S
Jason Hillyard
ARM Ltd
Jean-Philippe Lambert
RivieraWaves
Jeff Solum
Starkey Hearing Technologies
Jiawei Chen
ARM Ltd
Jim Ryan
ON Semiconductor
Jin-Kwon Lim
LG Electronics
Joel Linsky
Qualcomm, Inc.
Joerg Lebender
Sivantos GmbH
John Yi
ARM Ltd
Packetcraft, Inc.
Jonas Svedberg
Ericsson AB
Jonathan Tanner
Qualcomm, Inc.
Kanji Kerai
Facebook Technologies, LLC
Karim Mokhtar
Synopsys, Inc.
Khaled Ali
Synopsys, Inc.
Khaled Elsayed
Synopsys, Inc.
L.C. Ko
MediaTek
Latifa Ali
Synopsys, Inc.
Leif-Alexandre Aschehoug
Nordic Semiconductor ASA
Liu Huazhang
Hisilicon Technologies Co., Ltd.
Luiz Von Dentz
Intel Corporation
Łukasz Rymanowski
Codecoup
Magnus Eriksson
Intel Corporation
Mahmoud Samy
Synopsys, Inc.
Marcel Holtmann
Intel Corporation
Marcel Vlaming
GN Hearing A/S
Markus Schnell
Fraunhofer IIS
Martin Sehlstedt
Ericsson AB
Masahiko Seki
Sony Corporation
Masahiro Shimizu
Sony Corporation
Maximilian Schlegel
Fraunhofer IIS
Mayank Batra
Qualcomm Technologies International Ltd.
Michael Rougeux
Bose Corporation
Michael Ungstrup
Widex A/S
Mohan Mysore
Cypress Semiconductor Corporation
Morteza Rahchamani
ARM Ltd.
Nick D’Amato
Sonos
Nick Hunn
GN Hearing A/S
GN Resound
Niel Warren
Google
Ole Heftholm-Jensen
Samsung Electronics Co., Ltd.
Oren Haggai
Intel Corporation
Pål Håland
Nordic Semiconductor ASA
Peter Kroon
Intel Corporation
Peter Liu
Bose Corporation
Qiang Li
Barrot Technology Limited
Rangineni Balasubramanyam
Cypress Semiconductor Corporation
Rasmus Abildgren
Bose Corporation
Samsung Electronics Co., Ltd.
Riccardo Cavallari
Sivantos GmbH
WS Audiology Denmark A/S
Robert Bäuml
Sivantos GmbH
Robert D Hughes
Intel Corporation
Robin Heydon
Qualcomm, Inc.
Rohit Gupta
Cypress Semiconductor Corporation
Sachinakumar Hottigoudar
Cypress Semiconductor Corporation
Sam Geeraerts
NXP Semiconductors
Scott Walsh
Plantronics, Inc., Poly
Shawn Ding
Broadcom Corporation
Sherry Smith
Broadcom Corporation
Shwetha Mahadik
Mindtree Limited
Siegfried Lehmann
Apple, Inc.
Simon Jonghun Song
LG Electronics, Inc.
Søren Larsen
Widex A/S
Stefan Mijovic
Sivantos GmbH
Stephan Gehring
Sonova AG
Taeyoung Song
LG Electronics
Thorkild Pedersen
GN Hearing A/S
Tim Reilly
Bose Corporation
Tomas Frankkila
Ericsson AB
Tony Branch
T2labs-LLC
Sherry Ouyang
Intel Corporation
Yao Wang
Barrot Technology Limited

LE Audio IOP Participants

XX Shi
Airoha
Tao Yan
Airoha
MengZhe Lu
Airoha
Yao Wang
Barrot
Jingsha Lai
Barrot
Xiaohui Wu
Barrot
Caper Bonde
Bose
David Hughes
Broadcom Corporation
Sherry Smith
Broadcom Corporation
Chaojing Sun
Broadcom Corporation
Grzegorz Kolodziejczyk
Codecoup sp. z o.o.
Szymon Czapracki
Codecoup sp. z o.o.
Mariusz Skamra
Codecoup sp. z o.o.
Jakub Tyszkowski
Codecoup sp. z o.o. sp. k.
Thorkild Pedersen
GN Hearing A/S
Oktay Baris
GN Hearing A/S
Bihang Ni
GN Hearing A/S
Sreeram Tatapudi
Infineon Technologies AG
Sahana DN
Infineon Technologies AG
Hardikkumar Chauhan
Infineon Technologies AG
Luiz Von Dentz
Intel
Ella Chu
Microchip
Charlie Lee
Microchip
Naveen M N
Microchip
Nick Mazurek
Microsoft
Sam Paveza
Microsoft
Nidhi Venkatesh
Mindtree
Emil Gydesen
Nordic
Sam Geeraerts
NXP
Morteza Rahchamani
Packetcraft, Inc.
Parameshwar Kengond
Qualcomm, Inc.
Efstratios Chatzikyriakos
Qualcomm, Inc.
Prashant Agrawal
Qualcomm, Inc.
Pascal Chapelot
Qualcomm, Inc.
Hendrik Cordier
Qualcomm, Inc.
Sushil Deka
Qualcomm, Inc.
Lucrezia Fanizzi
Qualcomm, Inc.
Neil Hodgson
Qualcomm, Inc.
Harish Kumar
Qualcomm, Inc.
Shitiz Kumar
Qualcomm, Inc.
Gavin Meakes
Qualcomm, Inc.
Vasilis Michopoulos
Qualcomm, Inc.
Kameshwar Singh
Qualcomm, Inc.
Nagendra V
Qualcomm, Inc.
Anand Noubade
Qualcomm, Inc.
Yujuan Lyu
Realsil
Gu Qing
Realsil
Laurent Trarieux
CEVA – RivieraWaves

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