Our working group and committee members make Bluetooth technology the best it can be.
Working groups have been the driving force behind Bluetooth® technology, delivering innovations that help make the Internet of Things (IoT) a reality.
Every year, the Bluetooth Special Interest Group (SIG) celebrates the hard work and commitment of working groups, committee members, and contributors who have been recognized by their peers as making a difference in advancing Bluetooth technology. Thank you to the winners, and to all of our working group and committee members, for their dedication and contribution this year.
Outstanding New Technical Contributor
Wei Li
Nordic Semiconductor ASA
Core Specification Working Group
Wei Li obtained a Ph.D. degree in 2007 from the National Mobile Communications Research Laboratory of Southeast University, P.R. China. Since then, he has been working for wireless communication technologies for more than 15 years. In 2014, he joined Nordic Semiconductor, starting his new R&D role working with Bluetooth technology.
Łukasz Rymanowski
Codecoup
Generic Audio Working Group
Łukasz has been working with Bluetooth® technology since 2007. He co-founded Codecoup in 2015 to support clients in integrating Bluetooth technology into their products. Łukasz is an open source enthusiast and contributed to many projects. Recently, he focused on LE Audio specification development and bringing it into the Android Open Source Project.
Outstanding Technical Contributor
Andrew Estrada
Sony Electronics
Audio, Telephony, and Automotive Working Group (ATAWG)
A long-time contributor to advancing Bluetooth® technology, Andrew currently serves as chair of the Audio, Telephony, and Automotive Working Group (ATAWG). He worked as the project lead for the recently adopted Telephony and Media Audio Profile (TMAP) specification and is now leading the effort to develop the Gaming Audio Profile (GMAP) specification. Andrew also served in leadership positions in other standards bodies, including IEEE, Wi-Fi, and ECMA.
Chris White
Dolby Laboratories, Inc.
Audio, Telephony, and Automotive Working Group (ATAWG)
After playing rock ‘n’ roll full time for a few years, Chris was lucky enough to secure an important role at Dolby Laboratories. He helps customers implement Dolby technology into TVs, A/V receivers, and smartphones, and Chris served as the lead Bluetooth® engineer for Dolby’s first-ever consumer product, the Dolby Dimension headphone. He currently serves as Dolby’s sole full-time Bluetooth engineer, focusing on enabling next-generation wireless audio experiences.
Robin Heydon
Qualcomm Technologies, Inc.
Electronic Shelf Label Working Group
Robin Heydon is a senior director at Qualcomm, based in Cambridge, UK. He has worked with Bluetooth® technology for over 23 years and chaired various working groups over this time, including HCI, ESL, ULP, and Bluetooth Mesh. His contributions have helped improve the overall architecture of the technology within the Bluetooth Architecture Review Board, and he helped deliver key architectural improvements to the Bluetooth specifications, including Bluetooth LE, Attribute Protocol, and the ESL profile and service.
Piotr Winiarczyk
Silvair, Inc.
Mesh Working Group
A wireless solutions architect at Silvair with 20 years of experience working in the telecommunication and software industries, Piotr specializes in developing Bluetooth® Mesh technology for commercial lighting systems. Piotr enjoys solving complex problems and then optimizing solutions to make them simpler.
Omkar Kulkarni
Nordic Semiconductor ASA
Mesh Working Group
Omkar works as a staff R&D engineer with Nordic Semiconductor ASA. He works with a mesh stack development team and helps support activities for Bluetooth® Mesh. An active contributor to the Mesh Working Group since May 2016 and been a vice chair since October 2020, Omkar has contributed to the development of Mesh Protocol v1.1, Mesh Model v1.1, Mesh Device Firmware Update Model, Mesh Binary Large Object Transfer Model, Mesh Configuration Database Profile, Device Properties, and several NLC profile specifications. He participated in interoperability testing events for Bluetooth Mesh specifications and engages with the Bluetooth SIG through BARB, SATF, and APIC, providing feedback and contributions for other technical documents and Bluetooth SIG processes.
Bluetooth SIG Appreciation Award
Alicia Courtney
Broadcom Corporation
Bluetooth Qualification Review Board
An R&D SW Quality Engineer at Broadcom, Alicia currently serves as chair of the Bluetooth Qualification Review Board (BQRB) and vice chair of both the Bluetooth Test and Interoperability (BTI) Committee and of the Alignment and Process Improvement Committee (APIC). In Alicia’s 10+ years of working group involvement, she is grateful to contribute to the Bluetooth® technology standard alongside the Bluetooth SIG staff and other experts in the field of Bluetooth wireless technology who have taught her so much. She is committed to the continuous improvements of the Bluetooth Qualification Program, testing, and process optimizations to enhance the member experience and is excited to see what the future of Bluetooth technology brings.
Board of Directors Recognition Award
RTTF
| Leif Aschehoug | Asbjørn Sæbø | Jonathan Tanner | Mayank Batra | Simon Slupik | Marcel Holtmann |
| Robert Hughes | Robert Hulvey | Omkar Kulkarni |
SATF
| Robin Heydon | Piotr Winiarczyk |
Outstanding IOP Contributor Appreciation Award
The Qualcomm Team
Qualcomm Technologies, Inc.
Electronic Shelf Label Working Group
The team from Qualcomm Technologies, Inc. – Timothy Cook, Cheng Jiang, Ryan McCord, Matthew Seabold, and Chenhong Zhou – is recognized for their outstanding contributions toward the validation of the Electronic Shelf Label Profile and Service specifications having contributed more than 40 percent of the results entered.
The Google IOP Team
Google LLC
Audio, Telephony, and Automotive Working Group
The team from Google LLC – Ash Chen, Marie Janssen, Dayeong Lee, Benson Li, Christopher Rabasa, Christian Rollmann, and Jeremy Wu – is recognized for their outstanding contributions toward the validation of the Super Wide Band HFP enhancement, having contributed more than 40 percent of the results entered.
Philips Interoperable Solutions team
Koninklijke Philips N.V.
Medical Devices Working Group
The team from Philips – Erik Moll and Abdul Nabi – is recognized for their outstanding contributions toward the validation of the Generic Health Sensor and Elapsed Time Service specifications having contributed more than 40 percent of the results entered. These specifications enable the use of recognized medical nomenclature for a wide range of medical sensor devices using Bluetooth technology.
At Philips, we believe an enterprise-wide approach to interoperability can ensure that insight-rich data is put to meaningful and appropriate use, helping to transform the delivery of healthcare for everyone.
Erik and Abdul, as part of the Philips Interoperable Solutions team, work in a number of standards bodies and on various products to realize this vision.
The Silicon Laboratories IOP Team
Silicon Laboratories
Core Specification Working Group
The team from Silicon Laboratories – Lauri Hintsala, Lasse Huovinen, and Karoly Kovacs – is recognized for their outstanding contributions toward the validation of the Core Specification enhancements EAD and PAWR, having contributed more than 30 percent of the results entered.
Piotr Winiarczyk
Silvair, Inc.
Mesh Working Group
Recognized for his outstanding IOP contributions toward the validation of the Mesh NCL Profile specifications, Piotr contributed more than 60 percent of the results entered.
Bluetooth SIG appreciation – Recognition of IOP Participation
Core Specification Enhancements – EAD & PAwR
| Chi Kwan Broadcom Corporation |
Sean Lin Broadcom Corporation |
Timothy Cook Qualcomm Technologies, Inc. |
Karoly Kovacs Silicon Laboratories |
Lasse Huovinen Silicon Laboratories |
Lauri Hintsala Silicon Laboratories |
| Kyle Penri-William Ellisys |
Fabien Duvoux Ellisys |
Clement Vacheron Ellisys |
Rangineni Balasubramanyam Infineon Technologies AG |
Yu Chia Lin Infineon Technologies AG |
Hassan Elmadi Packetcraft, Inc. |
| Matthew Seabold Qualcomm Technologies, Inc. |
Priyanka Gupta Teledyne |
Dan James Teledyne |
Elapsed Time Service
| Craig Carlson F. Hoffmann-La Roche AG |
Abdul Nabi Koninklijke Philips N.V. |
Erik Moll Koninklijke Philips N.V. |
Leif Aschehoug Nordic Semiconductor ASA |
Electronic Shelf Label Profile & Service
| Pirun Lee Nordic Semiconductor ASA |
Timothy Cook Qualcomm Technologies, Inc. |
Matthew Seabold Qualcomm Technologies, Inc. |
Cheng Jiang Qualcomm Technologies, Inc. |
Ryan McCord Qualcomm Technologies, Inc |
Chenhong Zhou Qualcomm Technologies, Inc. |
| Karoly Kovacs Silicon Laboratories |
Tamas Kranicz Silicon Laboratories |
Generic Health Sensor Profile & Service
| Craig Carlson F. Hoffmann-La Roche AG |
Abdul Nabi Koninklijke Philips N.V. |
Erik Moll Koninklijke Philips N.V. |
Ella Chu Microchip Technology Incorporated |
Charlie Lee Microchip Technology Incorporated |
Leif Aschehoug Nordic Semiconductor ASA |
HFP Enhancement – Super Wide Band
| Tabish Rizvi Apple Inc. |
Sherry Smith Broadcom Corporation |
David Hughes Broadcom Corporation |
Ash Chen Google LLC |
Benson Li Google LLC |
|
| Christian Rollmann Google LLC |
Christopher Rabasa Google LLC |
Jeremy Wu Google LLC |
Marie Janssen Google LLC |
Dayeong Lee Google LLC |
Anil Kumar Vutukuru LTIMindtree |
| Amit Panvekar Qualcomm Technologies, Inc. |
Mesh NLC Profiles
| Omkar Kulkarni Nordic Semiconductor ASA |
Piotr Winiarczyk Silvair, Inc. |
Past Winners
2022
| Recipient Name | Member Company | Category | Group |
|---|---|---|---|
| Koorosh Akhavan | Qualcomm Technologies, Inc. | Outstanding New Technical Contributor | Core Specification Working Group |
| Christof Fersch | Dolby | Outstanding New Technical Contributor | Audio, Telephony, and Automotive Working Group |
| Andrew Estrada | Sony Corporation | Outstanding Technical Contributor | Audio, Telephony, and Automotive Working Group |
| Frank Berntsen | Nordic Semiconductor ASA | Outstanding Technical Contributor | Human Interface Device Working Group |
| Masahiko Seki | Sony Corporation | Outstanding Technical Contributor | Generic Audio Working Group |
| Piotr Winiarczyk | Silvair, Inc. | Outstanding Technical Contributor | Mesh Working Group |
| Clive Feather | Samsung | Outstanding Technical Contributor | Core Specification Working Group |
| Nick Hunn | WiFore Consulting | Bluetooth SIG Appreciation Award | Hearing Aid Working Group |
| Yao Wang | Barrot Technology Limited | Outstanding IOP Contributor Appreciation Award | Audio, Telephony, and Automotive Working Group |
| The Telink Mesh Team | Telink Semiconductor (Shanghai) Co., Ltd | Outstanding IOP Contributor Appreciation Award | Mesh Working Group |
| Grzegorz Kolodziejczyk, Mariusz Skamra, Jakub Tyszkowski, Łukasz Rymanowski | Codecoup | Outstanding IOP Contributor Appreciation Award | Hearing Aid Working Group |
| Sushil Deka, Shitiz Kumar, Prashant Agrawal, Parameshwar Kengond, Harish Kumar S, Tarun Goswami, Lucrezia Fanizzi, Pascal Chapelot, Stratos Chatzikyriakos, Mohammed Saleem Khan, Anantha Krishna | Qualcomm Technologies, Inc. | Outstanding IOP Contributor Appreciation Award | Generic Audio Working Group |
| Christian-Alexander Luszick, Craig Carlson, David Sempsrott, Rick Wilson, and Robert Sabo | F. Hoffmann-La Roche AG | Outstanding IOP Contributor Appreciation Award | Medical Devices Working Group |
| Frank Berntsen | Nordic Semiconductor ASA | Outstanding IOP Contributor Appreciation Award | Human Interface Device Working Group |
Bluetooth SIG appreciation – Recognition of IOP Participation
| Name | Member Company | Specification |
|---|---|---|
| Christian-BT Luszick | F. Hoffmann-La Roche AG | Authorization Control Profile and Service |
| Christoph Fischer | F. Hoffmann-La Roche AG | Authorization Control Profile and Service |
| Craig Carlson | F. Hoffmann-La Roche AG | Authorization Control Profile and Service |
| David Sempsrott | F. Hoffmann-La Roche AG | Authorization Control Profile and Service |
| Rick Wilson | F. Hoffmann-La Roche AG | Authorization Control Profile and Service |
| Robert Sabo | F. Hoffmann-La Roche AG | Authorization Control Profile and Service |
| Gerrit Niezen | Tidepool Project | Authorization Control Profile and Service |
| Nathaniel Hamming | Tidepool Project | Authorization Control Profile and Service |
| Tapani Otala | Tidepool Project | Authorization Control Profile and Service |
| Yao Wang | Barrot Technology Limited | Basic Audio Profile |
| Chaojing Sun | Broadcom Corporation | Basic Audio Profile |
| Sherry Smith | Broadcom Corporation | Basic Audio Profile |
| Grzegorz Kolodziejczyk | Codecoup sp. z o.o. | Basic Audio Profile |
| Mariusz Skamra | Codecoup sp. z o.o. | Basic Audio Profile |
| Jakub Tyszkowski | Codecoup sp. z o.o. | Basic Audio Profile |
| Łukasz Rymanowski | Codecoup sp. z o.o. | Basic Audio Profile |
| Sreeram Tatapudi | Infineon Technologies AG | Basic Audio Profile |
| Sahana DN | Infineon Technologies AG | Basic Audio Profile |
| Hardikkumar Chauhan | Infineon Technologies AG | Basic Audio Profile |
| Luiz Von Dentz | Intel Corporation | Basic Audio Profile |
| Ella Chu | Microchip Technology Incorporated | Basic Audio Profile |
| Charlie Lee | Microchip Technology Incorporated | Basic Audio Profile |
| Nidhi S Venkatesh | MindTree Limited | Basic Audio Profile |
| Badrinarayanan K | MindTree Limited | Basic Audio Profile |
| Anil Vutukuru | MindTree Limited | Basic Audio Profile |
| Harish Kumar S | Qualcomm Technologies, Inc. | Basic Audio Profile |
| Hendrik Cordier | Qualcomm Technologies, Inc. | Basic Audio Profile |
| Nagendra V | Qualcomm Technologies, Inc. | Basic Audio Profile |
| Pascal Chapelot | Qualcomm Technologies, Inc. | Basic Audio Profile |
| Prashant Agrawal | Qualcomm Technologies, Inc. | Basic Audio Profile |
| Sushil Deka | Qualcomm Technologies, Inc. | Basic Audio Profile |
| Vasilis Michopoulos | Qualcomm Technologies, Inc. | Basic Audio Profile |
| Inga Stotland | Intel Corporation | Battery Service 1.1 |
| Frank Berntsen | Nordic Semiconductor ASA | Battery Service 1.1 |
| Yao Wang | Barrot Technology Limited | Common Audio Profile |
| Sherry Smith | Broadcom Corporation | Common Audio Profile |
| Grzegorz Kolodziejczyk | Codecoup sp. z o.o. | Common Audio Profile |
| Jakub Tyszkowski | Codecoup sp. z o.o. | Common Audio Profile |
| Łukasz Rymanowski | Codecoup sp. z o.o. | Common Audio Profile |
| Hardikkumar Chauhan | Infineon Technologies AG | Common Audio Profile |
| Nidhi S Venkatesh | MindTree Limited | Common Audio Profile |
| Badrinarayanan K | MindTree Limited | Common Audio Profile |
| Anil Vutukuru | MindTree Limited | Common Audio Profile |
| Harish Kumar S | Qualcomm Technologies, Inc. | Common Audio Profile |
| Yao Wang | Barrot Technology Limited | Hearing Access Profile and Service |
| Grzegorz Kolodziejczyk | Codecoup sp. z o.o. | Hearing Access Profile and Service |
| Mariusz Skamra | Codecoup sp. z o.o. | Hearing Access Profile and Service |
| Jakub Tyszkowski | Codecoup sp. z o.o. | Hearing Access Profile and Service |
| Łukasz Rymanowski | Codecoup sp. z o.o. | Hearing Access Profile and Service |
| Thorkild Pedersen | GN Hearing A/S | Hearing Access Profile and Service |
| Oktay Baris | GN Hearing A/S | Hearing Access Profile and Service |
| Naveen M N | Hearing Access Profile and Service | |
| Yao Wang | Barrot Technology Limited | Public Broadcast Profile |
| Sherry Smith | Broadcom Corporation | Public Broadcast Profile |
| Laurent Trarieux | CEVA-Riveriawaves | Public Broadcast Profile |
| Grzegorz Kolodziejczyk | Codecoup sp. z o.o. | Public Broadcast Profile |
| Jakub Tyszkowski | Codecoup sp. z o.o. | Public Broadcast Profile |
| Łukasz Rymanowski | Codecoup sp. z o.o. | Public Broadcast Profile |
| Thorkild Pedersen | GN Hearing A/S | Public Broadcast Profile |
| Yao Wang | Barrot Technology Limited | Telephony and Media Audio Profile |
| Sherry Smith | Broadcom Corporation | Telephony and Media Audio Profile |
| Laurent Trarieux | CEVA-Riveriawaves | Telephony and Media Audio Profile |
| Grzegorz Kolodziejczyk | Codecoup sp. z o.o. | Telephony and Media Audio Profile |
| Jakub Tyszkowski | Codecoup sp. z o.o. | Telephony and Media Audio Profile |
| Łukasz Rymanowski | Codecoup sp. z o.o. | Telephony and Media Audio Profile |
| Efstratios Chatzikyriakos | Qualcomm Technologies, Inc. | Telephony and Media Audio Profile |
| Parameshwar Kengond | Qualcomm Technologies, Inc. | Telephony and Media Audio Profile |
| Prashant Agrawal | Qualcomm Technologies, Inc. | Telephony and Media Audio Profile |
| Sushil Deka | Qualcomm Technologies, Inc. | Telephony and Media Audio Profile |
| Michal Narajowski | Codecoup sp. z o.o. | Mesh Device Firmware Update Mesh Profile Enhancements ( CBP, ENH, EPA, PRB, SBR) |
| Espressif Systems (Shanghai) Co., Ltd. | Mesh Device Firmware Update Mesh Profile Enhancements ( CBP, ENH, EPA, PRB, SBR) |
|
| Mike Weng | Infineon Technologies AG | Mesh Device Firmware Update Mesh Profile Enhancements ( CBP, ENH, EPA, PRB, SBR) |
| Badrinarayanan K | MindTree Limited | Mesh Device Firmware Update Mesh Profile Enhancements ( CBP, ENH, EPA, PRB, SBR) |
| Peter Kozar | Silicon Laboratories | Mesh Device Firmware Update Mesh Profile Enhancements ( CBP, ENH, EPA, PRB, SBR) |
| Piotr Winiarczyk | Silvair, Inc. | Mesh Device Firmware Update Mesh Profile Enhancements ( CBP, ENH, EPA, PRB, SBR) |
| Telink Semiconductor (Shanghai) Co., Ltd | Mesh Device Firmware Update Mesh Profile Enhancements ( CBP, ENH, EPA, PRB, SBR) |
2021
| Recipient Name | Member Company | Category | Group |
|---|---|---|---|
| Sophia Feil | Expleo Germany GmbH | Outstanding New Technical Contributor | Audio, Telephony, and Automotive Working Group |
| Qing An | Alibaba Group | Outstanding New Technical Contributor | Mesh Working Group |
| Andrew Estrada | Sony Corporation | Outstanding Technical Contributor | Audio, Telephony, and Automotive Working Group |
| Chris Church | Qualcomm | Outstanding Technical Contributor | Generic Audio Working Group |
| Angel Polo | Broadcom Incorporated | Outstanding Technical Contributor | Core Specification Working Group |
| Piotr Winiarczyk | Silvair, Inc. | Outstanding Technical Contributor | Mesh Working Group |
| Szymon Slupik | Silvair, Inc. | Outstanding Technical Contributor | Mesh Working Group |
| Alicia Courtney | Broadcom | Bluetooth SIG appreciation – Working Group Contributor | BTI & BQRB Working Group |
2020
| Recipient Name | Member Company | Category | Group |
|---|---|---|---|
| Pouria Zand | Cypress Semiconductor Corporation | Outstanding New Technical Contributor | Core Specification Working Group |
| Piergiuseppe Di Marco | Silvair, Inc. | Outstanding New Technical Contributor | Mesh Working Group |
| Andrew Estrada | Sony Corporation | Outstanding Technical Contributor of the Year | Audio, Telephony, and Automotive Working Group |
| Jori Rintahaka | Silicon Laboratories | Outstanding Technical Contributor of the Year | Mesh Working Group |
| Tomas Motos | Texas Instruments Incorporated | Outstanding Technical Contributor of the Year | Core Specification Working Group |
| Chris Church | Qualcomm | Outstanding Technical Contributor of the Year | Generic Audio Working Group |
| Piotr Winiarczyk | Silvair, Inc. | Outstanding Technical Contributor of the Year | Mesh Working Group |
| Asbjørn Saebø | Nordic Semiconductor ASA | Bluetooth SIG appreciation – Working Group Contributor | Generic Audio Working Group |
2019
| Recipient Name | Member Company | Category | Group |
|---|---|---|---|
| Mayank Batra | Qualcomm Technologies, Inc. | Working Group/Committee Chair of the Year | Core Specification Working Group |
| Szymon Slupik | Silvair, Inc. | Working Group/Committee Chair of the Year | Mesh Working Group |
| Mesh Working Group | n/a | Working Group of the Year | Mesh Working Group |
| Danilo Blasi | STMicroelectronics | Outstanding Technical Contributor of the Year | Mesh Working Group |
| Kanji Kerai | Sivantos GmbH | Outstanding Technical Contributor of the Year | Core Specification Working Group |
| Ravi Bamidi | Silvair, Inc. | Outstanding New Contributor in Bluetooth SIG Groups | Mesh Working Group |
| Robert Hughes | Intel Corporation | Chairman’s Award | n/a |
2018
| Recipient Name | Member Company | Category | Group |
|---|---|---|---|
| Mayank Batra | Qualcomm | Working Group/Committee Chair of the Year | Core Specification Working Group |
| Mesh Working Group | n/a | Working Group of the Year Award | Mesh Working Group |
| Piotr Winiarczyk | Silvair, Inc. | Outstanding Technical Contributor of the Year Award | Mesh Working Group |
| Himanshu Bhalla | Intel Corporation | Outstanding New Contributor to Bluetooth SIG Groups | Generic Audio Working Group |
| Felix Bootz | F. Hoffmann-La Roche AG | Key Contributor to Reconnection Configuration Profile and Service | Medical Devices Working Group |
| Harald Prinzhorn | F. Hoffmann-La Roche AG | Key Contributor to Insulin Delivery Profile and Service | Medical Devices Working Group |
2017
| Recipient Name | Member Company | Category | Group |
|---|---|---|---|
| Brian Redding | Qualcomm | For Outstanding Contributions to the Adoption of Bluetooth Core Specification 5 & Core Specification Supplement 7 | Core Specification Working Group |
| Clive Feather | Samsung Electronics Co., Ltd. | For Outstanding Contributions to the Adoption of Bluetooth Core Specification 5 & Core Specification Supplement 7, For Outstanding Contributions to the Adoption of Bluetooth Core Specification Addendum 6 and For Outstanding Contributions to the Adoption of Errata Service Release 10 | Core Specification Working Group |
| Gerard Harbers | Xicato Inc. | Outstanding New Contributor in Bluetooth SIG Groups and For Outstanding Contributions to the Adoption of Mesh Device Properties 1.0 | Mesh Working Group |
| Guillaume Schatz | EM MICROELECTRONIC MARIN SA | For Outstanding Contributions to the Adoption of Fitness Machine Profile and Service | Sports & Fitness Working Group |
| Joel Linsky | Qualcomm | For Outstanding Contributions to the Adoption of Bluetooth Core Specification Addendum 6 and For Outstanding Contributions to the Adoption of Bluetooth Core Specification 5 & Core Specification Supplement 7 | Core Specification Working Group |
| Leif-Alexandre Aschehoug | Nordic Semiconductor ASA | For Outstanding Contributions to the Adoption of Fitness Machine Profile and Service and For Outstanding Contributions to the Adoption of GATT Specification Supplement | Sports & Fitness Working Group |
| Michael Ungstrup | Widex A/S | Outstanding New Contributor in Bluetooth SIG Groups | Hearing Aid Working Group |
| Olivia Bellamou-Huet | Assystem | For Outstanding Contributions to the Adoption of Message Access Profile 1.4 | Audio, Telephony, and Automotive Working Group |
| Piotr Winiarczyk | Silvair, Inc. | For Outstanding Contributions to the Adoption of Mesh Profile Specification 1.0 and For Outstanding Contributions to the Adoption of Mesh Model Specification 1.0 | Mesh Working Group and Architectural Review Board |
| Robert Hughes | Intel Corporation | For Outstanding Contributions to the Adoption of Mesh Profile Specification 1.0 | Mesh Working Group |
| Robin Heydon | Qualcomm | For Outstanding Contributions to the Adoption of Mesh Profile Specification 1.0 and For Outstanding Contributions to the Adoption of Mesh Device Properties 1.0 | Mesh Working Group and Architectural Review Board |
| Szymon Slupik | Silvair, Inc. | Working Group/Committee Chair of the Year, Working Group of the Year Award, Outstanding Technical Contributor of the Year Award and For Outstanding Contributions to the Adoption of Mesh Model Specification 1.0 | Mesh Working Group |
| Tomas Motos | Texas Instruments Incorporated | For Outstanding Contributions to the Adoption of Bluetooth Core Specification 5 & Core Specification Supplement 7 | Core Specification Working Group |
2016
| Recipient Name | Member Company | Category | Group |
|---|---|---|---|
| Mesh Working Group (Szymon and Bob) | Working Group of the Year | Mesh Working Group | |
| Robert Hughes | Intel Corporation | Working Group/Committee Chair of the Year | Mesh Working Group |
| Brian Redding | Qualcomm | Outstanding Technical Contributor of the Year | Core Specification Working Group |
| Szymon Slupik | Seed Labs Inc. | Outstanding Technical Contributor of the Year | Mesh Working Group |
| Olivia Bellamou-Huet | Berner & Mattner Systemtechnik GmbH | Outstanding New Contributor in Bluetooth SIG Groups | Audio, Telephony and Automotive & Sports and Fitness Working Groups |
| Sam Geeraerts | NXP Semiconductors | Outstanding New Contributor in Bluetooth SIG Groups | Core Specification Working Group |
| Joel Linsky | Qualcomm | For Outstanding Contributions to the Adoption of Core Specification Addendum 5 | Core Specification Working Group |
| Robert Hughes | Intel Corporation | For Outstanding Contributions to the Adoption of Transport Discovery Service | Discovery of Things Working Group |
| Jingu Choi | LG Electronics Inc. | For Outstanding Contributions to the Adoption of Transport Discovery Service | Discovery of Things Working Group |
| Chris Church | Qualcomm | For Outstanding Contributions to the Adoption of Transport Discovery Service | Discovery of Things Working Group |
| Casper Bonde | Samsung Electronics Co., Ltd. | For Outstanding Contributions to the Adoption of Message Access Profile 1.3 | Audio, Telephony and Automotive Working Group |
| Dominik Sollfrank | Berner & Mattner Systemtechnik GmbH | For Outstanding Contributions to the Adoption of Message Access Profile 1.3 | Audio, Telephony and Automotive Working Group |
| Guillaume Schatz | Polar Electro Oy | For Outstanding Contributions to the Adoption of Cycling Power Profile & Service 1.1 | Sports and Fitness Working Group |
| Laurence Richardson | Qualcomm | For Outstanding Contributions to the Adoption of Object Transfer Profile & Service | Sports and Fitness Working Group |
| Guillaume Schatz | Polar Electro Oy | For Outstanding Contributions to the Adoption of Object Transfer Profile & Service | Sports and Fitness Working Group |
| Robert Hughes | Intel Corporation | For Outstanding Contributions to the Adoption of Object Transfer Profile & Service | Sports and Fitness Working Group |
| Leif-Alexandre Aschehoug | Nordic Semiconductor ASA | For Outstanding Contributions to the Adoption of Object Transfer Profile & Service | Sports and Fitness Working Group |
