specifications

Awards & recognition

Our working group and committee members make Bluetooth technology the best it can be

Working groups have been the driving force behind Bluetooth® technology, delivering innovations that help make the Internet of Things (IoT) a reality.


Every year, the Bluetooth Special Interest Group (SIG) celebrates the hard work and commitment of working groups, committee members, and contributors who have been recognized by their peers as making a difference in advancing Bluetooth technology.  Thank you to the winners, and to all of our working group and committee members, for their dedication and contribution this year.

Outstanding contributor award

Apple Inc.
Hearing Aid Working Group

Hai Shalom is a professional in wireless connectivity systems and standards with 25 years of experience. He develops secure and privacy-conscious systems that enhance wired and wireless connectivity. His recent roles include senior Bluetooth standards architect at Apple, Android standards lead at Google, and principal engineer/manager at Qualcomm. He holds a Bachelor of Science in Computer Science and Master of Science in Computer Science.

Harish Balasubramaniam
Intel Corporation
Core Specification Working Group

Hannu Mallat
Silicon Laboratories
Core Specification Working Group

Ricardo Kehrle Miranda
Samsung Cambridge Solution Centre
Mesh Working Group

Menzo Wentink
Qualcomm Technologies, Inc.
Core Specification Working Group

Piotr Winiarczyk
Silvair, Inc.
Mesh Working Group

Junsen Wu
MediaTek Inc.
Core Specification Working Group

Outstanding leadership award

Joel Linsky is a vice president of engineering at Qualcomm where he leads the Bluetooth, UWB, and 15.4 team. He has been a key contributor to Bluetooth technology for over 25 years, where he has focused on core technology benefiting all product types and use cases.

Toby Nixon is a principal technical project manager at the Bluetooth SIG and chairs the Core Specification Working Group. A 30-year Microsoft veteran who has been involved in the development of technical standards for over 40 years in many organizations, he served on the Bluetooth SIG Board of Directors for 12 years and as chair for eight years before joining the SIG staff.

Michael deVenecia
Bluetooth SIG, Inc.
Audio Working Groups (ATA, GA and HA)

Andrew Estrada
Sony Group Corporation
Audio Working Groups (ATA, GA and HA)

Leonard (Len) Ott
Socket Mobile, Inc.
Mesh Working Group

Szymon Slupik
Silvair Inc.
Mesh Working Group

Rachel Theriot
Bluetooth SIG, Inc.
Alignment and Process Improvement Committee

Working group contributor award

Pontus Arvidson
Ericsson AB
Core Specification Working Group

Helmut Eder
Cochlear Limited
Mesh Working Group

Oren Haggai
Apple Inc.
Core Specification Working Group

Karoly Kovacs
Silicon Laboratories
Hearing Aid Working Group

Omkar Kulkarni
Nordic Semiconductor ASA
Electronic Shelf Label Working Group

Outstanding IOP contributor appreciation award

Expleo logo

Audio, Telephony, and Automotive Working Group

Atef Kort from Expleo Germany GmbH is recognized for outstanding contributions to the validation of the Call Forwarding Feature and Call Duration Information specifications, having contributed more than 50 percent of the results entered.

Infineon logo

Automation Working Group

Victor Zhodzishsky from Infineon Technologies AG is recognized for his outstanding contributions towards the validation of the Industrial Measurement Devices Profile and Service Specifications. 

Nordic Semiconductor logo

Core Specification Working Group

The team from Nordic Semiconductor ASA — Adam Cavender, Timothy Keys, Aleksandar Stanoev — is recognized for outstanding contributions to the validation of the Core Specification 6.2 enhancements, having contributed more than 35 percent of the results entered.

Google logo

Direction Finding Working Group

The team from Google LLC— Ash Chen, Chienyuan Huang, Benson Li — is recognized for outstanding contributions to the validation of the Ranging Profile and Service specifications, having contributed more than 36 percent of the results entered.

NXP logo
Telink Semiconductor logo

Human Interface Device Working Group

The team from Telink Semiconductor (Shanghai) Co., Ltd — Qihang Mou, Jan Slupski, Sihui Wang — is recognized for outstanding contributions to the validation of the HID ISO specification, having contributed more than 50 percent of the results entered.

Special recognition for Receiver Blocking Resilience testing support

Steve Jones
Samsung Cambridge Solution Centre

Magnus Sommansson
Qualcomm Technologies, Inc.

Kenton Payne
Rohde & Schwarz

Niclas Granqvist
Logitech

Special recognition for Bluetooth® Qualification Process improvements & execution

Alicia Courtney
Broadcom Corporation

Shirin Ebrahimi-Taghizadeh PhD
Microsoft Corporation

Lewis Chan
Bluetooth SIG, Inc.

Sung Pak
Bluetooth SIG, Inc.

Mohana Lakshmipathy
Bluetooth SIG, Inc.

Svitlana Dyerabina
Bluetooth SIG, Inc.

Bluetooth SIG appreciation – Recognition of IOP participation

Yunkai Qian
Broadcom Corporation

Brevalan Ung
NXP B.V.

Mathias Baert
NXP B.V.

Da Young Yun
NXP B.V.

Abdul Mujeeb
Synaptics Incorporated

Nagur Basha Shaik
Synaptics Incorporated

Fabien Duvoux
Ellisys

Antoine Blancy
Ellisys

Clement Vacheron
Ellisys

Kyle Penri-Williams
Ellisys

Hagen Hentschel
Ellisys

Joseph Robert
LTIMINDTREE LIMITED

Brevalan Ung
NXP B.V.

Mathias Baert
NXP B.V.

Da Young Yun
NXP B.V.

Vivien Leng
RivieraWaves

Dimitrios Adamidis
RivieraWaves

Tianxu Wu
Bestechnic (Shanghai) Co., Ltd

Fabien Duvoux
Ellisys

Antoine Blancy
Ellisys

Clement Vacheron
Ellisys

Kyle Penri-Williams
Ellisys

Hagen Hentschel
Ellisys

Vlad Tsigan
Intel Corporation

Philippe Chazot
Logitech

Joseph Robert
LTIMINDTREE LIMITED

Adam Cavender
Nordic
Semiconductor ASA

Aleksandar Stanoev
Nordic Semiconductor ASA

Timothy Keys
Nordic Semiconductor ASA

Jie Zeng
Qualcomm Technologies, Inc.

Kai Jia
Telink Semiconductor (Shanghai) Co., Ltd

Qiuwei Chen
Telink Semiconductor (Shanghai) Co., Ltd

Lijing Liang
Telink Semiconductor (Shanghai) Co., Ltd

Atef Kort
Expleo Germany GmbH

Shawn Saenger
OpenSynergy GmbH

Atef Kort
Expleo Germany GmbH

Badrinarayanan K
LTIMINDTREE LIMITED

Nidhi Sakaleshpur Venkatesh
LTIMINDTREE LIMITED

Anil Vutukuru
LTIMINDTREE LIMITED

Shawn Saenger
OpenSynergy GmbH

Victor Zhodzishsky
Infineon Technologies AG

Eduardo Velez Pellicer
Robert Bosch GmbH

Lukasz Rymanowski
Codecoup sp. z o.o.

Badrinarayanan K
LTIMINDTREE LIMITED

Nidhi Sakaleshpur Venkatesh
LTIMINDTREE LIMITED

Anil Vutukuru
LTIMINDTREE LIMITED

Qihang Mou
Telink Semiconductor (Shanghai) Co., Ltd

Takashi Tomita
Infineon Technologies AG

Jan Slupski
Telink Semiconductor (Shanghai) Co., Ltd

Qihang Mou
Telink Semiconductor (Shanghai) Co., Ltd

Sihui Wang
Telink Semiconductor (Shanghai) Co., Ltd

Benson Li
Google LLC

Chienyuan Huang
Google LLC

Ash Chen
Google LLC

Yogesh Ulhas
Kamat Mhamai
Infineon Technologies AG

Andreea Dumitrache
NXP B.V.

Silviu Petria
NXP B.V.

Adrian-Constantin Dudau
NXP B.V.

Shitiz Kumar
Qualcomm Technologies, Inc.

Sushil Deka
Qualcomm Technologies, Inc.

Qinghua Fan
Telink Semiconductor
(Shanghai) Co., Ltd

Jan Slupski
Telink Semiconductor
(Shanghai) Co., Ltd

Past winners

Recipient NameMember CompanyCategoryGroup
Jeff SolumStarkey Hearing TechnologiesLeadership AwardHearing Aid Working Group
Chris WhiteDolby Laboratories, Inc.Innovator of the Year AwardAudio, Telephony, and Automotive Working Group 
Asbjørn SæbøNordic Semiconductor ASAOutstanding Technical Contributor AwardHearing Aid Working Group
Vlad Tsigan
Chethan Tumkur Narayan
Luiz Von Dentz
Intel CorporationOutstanding IOP Contributor Appreciation AwardAudio, Telephony, and Automotive Working Group
Victor ZhodzishskyInfineon Technologies AGOutstanding IOP Contributor Appreciation AwardAutomation Working Group
Shawn Ding
Irene Fan
Shanshan Jiang
Sean Lin
Yunkai Qian
Balakumar Ramalingam
Wen-Hsin Wang
Lewis Weng
Broadcom CorporationOutstanding IOP Contributor Appreciation AwardCore Specification Working Group
Benson Li
Jack He
Rongxuan Liu
Google LLCOutstanding IOP Contributor Appreciation AwardHearing Aid Working Group

Special Recognition Awards

Recipient NameMember CompanyCategory
Leif-Alexandre AschehougNordic Semiconductor ASASpecial Recognition for Outstanding Leadership in BARB
Alicia CourtneyBroadcom CorporationSpecial Recognition for Outstanding Contribution to the Qualification Process Improvements and QPRD
Fabien DuvouxEllisysSpecial Recognition for Channel Sounding Remote IOP Testing
Kyle Penri-WilliamsEllisysSpecial Recognition for Channel Sounding Remote IOP Testing
Clement VacheronEllisysSpecial Recognition for Channel Sounding Remote IOP Testing
Tim NewtonRF CreationsSpecial Recognition for Channel Sounding Remote IOP Testing
Peter FordRF CreationsSpecial Recognition for Channel Sounding Remote IOP Testing
Qi JiangGoogle LLCSpecial Recognition for Channel Sounding IOP Support
Shawn DingBroadcom CorporationSpecial Recognition for Channel Sounding IOP Support
Angel PoloBroadcom CorporationSpecial Recognition for Channel Sounding IOP Support

Bluetooth SIG appreciation – Recognition of IOP Participation

NameMember CompanySpecification
Yann Ly-GagnonApple Inc.Core Specification 6.0 Enhancements – Channel Sounding
Roman ChernobelskyApple Inc.Core Specification 6.0 Enhancements – Channel Sounding
David LevyApple Inc.Core Specification 6.0 Enhancements – Channel Sounding
Ido GrossApple Inc.Core Specification 6.0 Enhancements – Channel Sounding
Tomer HershkovitzApple Inc.Core Specification 6.0 Enhancements – Channel Sounding
Balakumar RamalingamBroadcom CorporationCore Specification 6.0 Enhancements – Channel Sounding
Irene FanBroadcom CorporationCore Specification 6.0 Enhancements – Channel Sounding
Lewis WengBroadcom CorporationCore Specification 6.0 Enhancements – Channel Sounding
Sean LinBroadcom CorporationCore Specification 6.0 Enhancements – Channel Sounding
Shanshan JiangBroadcom CorporationCore Specification 6.0 Enhancements – Channel Sounding
Shawn DingBroadcom CorporationCore Specification 6.0 Enhancements – Channel Sounding
Wen-Hsin WangBroadcom CorporationCore Specification 6.0 Enhancements – Channel Sounding
Yunkai QianBroadcom CorporationCore Specification 6.0 Enhancements – Channel Sounding
Fabien DUVOUXEllisysCore Specification 6.0 Enhancements – Channel Sounding
Kyle Penri-WilliamsEllisysCore Specification 6.0 Enhancements – Channel Sounding
Clement VacheronEllisysCore Specification 6.0 Enhancements – Channel Sounding
Qi JiangGoogle LLCCore Specification 6.0 Enhancements – Channel Sounding
Joe ChangLitepointCore Specification 6.0 Enhancements – Channel Sounding
Qiang FuLitepointCore Specification 6.0 Enhancements – Channel Sounding
Tushar PatelLitepointCore Specification 6.0 Enhancements – Channel Sounding
Alexandre DauphinaisNordic Semiconductor ASACore Specification 6.0 Enhancements – Channel Sounding
Ivan IushkovNordic Semiconductor ASACore Specification 6.0 Enhancements – Channel Sounding
Erik Semb OmreNordic Semiconductor ASACore Specification 6.0 Enhancements – Channel Sounding
Thomas JohansenNordic Semiconductor ASACore Specification 6.0 Enhancements – Channel Sounding
Erik SandgrenNordic Semiconductor ASACore Specification 6.0 Enhancements – Channel Sounding
Ryan ChuNordic Semiconductor ASACore Specification 6.0 Enhancements – Channel Sounding
Pascal BernardNXP B.V.Core Specification 6.0 Enhancements – Channel Sounding
James ZhangNXP B.V.Core Specification 6.0 Enhancements – Channel Sounding
Endy QinNXP B.V.Core Specification 6.0 Enhancements – Channel Sounding
Mihai-Ionut StanciuNXP B.V.Core Specification 6.0 Enhancements – Channel Sounding
Luc RevardelNXP B.V.Core Specification 6.0 Enhancements – Channel Sounding
Wenbo QiNXP B.V.Core Specification 6.0 Enhancements – Channel Sounding
Olivier JeanNXP B.V.Core Specification 6.0 Enhancements – Channel Sounding
Santiago GarciaNXP B.V.Core Specification 6.0 Enhancements – Channel Sounding
John VandermeerNXP B.V.Core Specification 6.0 Enhancements – Channel Sounding
Khurram WaheedNXP B.V.Core Specification 6.0 Enhancements – Channel Sounding
Jerome BrillantNXP B.V.Core Specification 6.0 Enhancements – Channel Sounding
Hassan ElmadiPacketcraft, Inc.Core Specification 6.0 Enhancements – Channel Sounding
Ram Mohan KorukondaQualcomm Technologies, Inc.Core Specification 6.0 Enhancements – Channel Sounding
Mayank BatraQualcomm Technologies, Inc.Core Specification 6.0 Enhancements – Channel Sounding
Rachelle ChenQualcomm Technologies, Inc.Core Specification 6.0 Enhancements – Channel Sounding
Chris HolbrowQualcomm Technologies, Inc.Core Specification 6.0 Enhancements – Channel Sounding
Mohit MaheshwariQualcomm Technologies, Inc.Core Specification 6.0 Enhancements – Channel Sounding
Naveen Kumar Reddy KanakantiQualcomm Technologies, Inc.Core Specification 6.0 Enhancements – Channel Sounding
Tim NewtonRF CreationsCore Specification 6.0 Enhancements – Channel Sounding
Peter FordRF CreationsCore Specification 6.0 Enhancements – Channel Sounding
Kenton PayneRohde & Schwarz Services LtdCore Specification 6.0 Enhancements – Channel Sounding
Trine JensenSamsung Electronics Co., Ltd.Core Specification 6.0 Enhancements – Channel Sounding
Sune Timm SimonsenSamsung Electronics Co., Ltd.Core Specification 6.0 Enhancements – Channel Sounding
Allan MadsenSamsung Electronics Co., Ltd.Core Specification 6.0 Enhancements – Channel Sounding
Lauri HintsalaSilicon LaboratoriesCore Specification 6.0 Enhancements – Channel Sounding
Wesam KoraimSilicon LaboratoriesCore Specification 6.0 Enhancements – Channel Sounding
Karim MokhtarSynopsys, Inc.Core Specification 6.0 Enhancements – Channel Sounding
Ahmed IsmailSynopsys, Inc.Core Specification 6.0 Enhancements – Channel Sounding
Priyanka GuptaTeledyne Lecroy, Inc.Core Specification 6.0 Enhancements – Channel Sounding
Rishu KumarTeledyne Lecroy, Inc.Core Specification 6.0 Enhancements – Channel Sounding
Varun GopalanTeledyne Lecroy, Inc.Core Specification 6.0 Enhancements – Channel Sounding
Yuexin LiuTelink Semiconductor (Shanghai) Co., LtdCore Specification 6.0 Enhancements – Channel Sounding
Sihui WangTelink Semiconductor (Shanghai) Co., LtdCore Specification 6.0 Enhancements – Channel Sounding
Fan QinghuaTelink Semiconductor (Shanghai) Co., LtdCore Specification 6.0 Enhancements – Channel Sounding
Jan SlupskiTelink Semiconductor (Shanghai) Co., LtdCore Specification 6.0 Enhancements – Channel Sounding
Shanshan JiangBroadcom CorporationDecision Based Advertising Filtering
Shawn DingBroadcom CorporationDecision Based Advertising Filtering
Fabien DUVOUXEllisysDecision Based Advertising Filtering
Kyle Penri-WilliamsEllisysDecision Based Advertising Filtering
Clement VacheronEllisysDecision Based Advertising Filtering
Joseph RobertLTIMINDTREE LIMITEDDecision Based Advertising Filtering
Wenbo QiNXP B.V.Decision Based Advertising Filtering
Shanshan JiangBroadcom CorporationEnhancements for ISOAL
Shawn DingBroadcom CorporationEnhancements for ISOAL
Fabien DUVOUXEllisysEnhancements for ISOAL
Kyle Penri-WilliamsEllisysEnhancements for ISOAL
Clement VacheronEllisysEnhancements for ISOAL
Thorkild PedersenGN Hearing A/SEnhancements for ISOAL
ChaoYang WuInfineon Technologies AGEnhancements for ISOAL
Vishal DhullIntel CorporationEnhancements for ISOAL
Joseph RobertLTIMINDTREE LIMITEDEnhancements for ISOAL
Sam GeeraertsNXP B.V.Enhancements for ISOAL
Raoul GrenierNXP B.V.Enhancements for ISOAL
Sean LinBroadcom CorporationFrame Space Update
Shawn DingBroadcom CorporationFrame Space Update
Fabien DUVOUXEllisysFrame Space Update
Kyle Penri-WilliamsEllisysFrame Space Update
Clement VacheronEllisysFrame Space Update
Joseph RobertLTIMINDTREE LIMITEDFrame Space Update
Johan StridkvistNordic Semiconductor ASAFrame Space Update
Erik SandgrenNordic Semiconductor ASAFrame Space Update
Antonios ProdromakisRenesasFrame Space Update
Mesh DavarajRenesasFrame Space Update
Theodora DimitropoulouRenesasFrame Space Update
Frederik JensenSamsung Electronics Co., Ltd.Frame Space Update
Marcus JensenSamsung Electronics Co., Ltd.Frame Space Update
Søren AndersenSamsung Electronics Co., Ltd.Frame Space Update
Karim MokhtarSynopsys, Inc.Frame Space Update
Ahmed IsmailSynopsys, Inc.Frame Space Update
Sean LinBroadcom CorporationLL Extended Feature Set
Shanshan JiangBroadcom CorporationLL Extended Feature Set
Shawn DingBroadcom CorporationLL Extended Feature Set
Fabien DUVOUXEllisysLL Extended Feature Set
Kyle Penri-WilliamsEllisysLL Extended Feature Set
Clement VacheronEllisysLL Extended Feature Set
Joseph RobertLTIMINDTREE LIMITEDLL Extended Feature Set
Johan StridkvistNordic Semiconductor ASALL Extended Feature Set
Frederik JensenSamsung Electronics Co., Ltd.LL Extended Feature Set
Marcus JensenSamsung Electronics Co., Ltd.LL Extended Feature Set
Søren AndersenSamsung Electronics Co., Ltd.LL Extended Feature Set
Vlad TsiganIntel CorporationGaming Audio Profile
Chethan Tumkur NarayanIntel CorporationGaming Audio Profile
Luiz Von DentzIntel CorporationGaming Audio Profile
Nidhi Sakaleshpur VenkateshLTIMINDTREE LIMITEDGaming Audio Profile
Samuel PavezaMicrosoft CorporationGaming Audio Profile
Emil GydesenNordic Semiconductor ASAGaming Audio Profile
Didier LauwerysNXP B.V.Gaming Audio Profile
Peter FordRF CreationsGaming Audio Profile
Anish SinghQualcomm Technologies, Inc.Gaming Audio Profile
Parameshwar KengondQualcomm Technologies, Inc.Gaming Audio Profile
Sushil DekaQualcomm Technologies, Inc.Gaming Audio Profile
Tarun GoswamiQualcomm Technologies, Inc.Gaming Audio Profile
Ryo TakaiSony Group CorporationGaming Audio Profile
Hiroki MakinoSony Group CorporationGaming Audio Profile
Thorkild PedersenGN Hearing A/SBroadcast Audio URI
Benson LiGoogle LLCBroadcast Audio URI
Jack HeGoogle LLCBroadcast Audio URI
Rongxuan LiuGoogle LLCBroadcast Audio URI
Peter FordRF CreationsBroadcast Audio URI
Mats LennartssonSony Group CorporationBroadcast Audio URI
Viswanth BhagavatulaSony Group CorporationBroadcast Audio URI
Franz SpringerHoffmann SEIndustrial Measurment Devices Profile and Service
Victor ZhodzishskyInfineon Technologies AGIndustrial Measurment Devices Profile and Service
Recipient NameMember CompanyCategoryGroup
Wei LiNordic Semiconductor ASAOutstanding New Technical ContributorCore Specification Working Group
Łukasz RymanowskiCodecoupOutstanding New Technical ContributorGeneric Audio Working Group
Andrew EstradaSony ElectronicsOutstanding Technical ContributorAudio, Telephony, and Automotive Working Group (ATAWG)
Chris WhiteDolby Laboratories, Inc.Outstanding Technical ContributorAudio, Telephony, and Automotive Working Group (ATAWG)
Robin HeydonQualcomm Technologies, Inc.Outstanding Technical ContributorElectronic Shelf Label Working Group
Piotr WiniarczykSilvair, Inc.Outstanding Technical ContributorMesh Working Group
Omkar KulkarniNordic Semiconductor ASAOutstanding Technical ContributorMesh Working Group
Alicia CourtneyBroadcom CorporationBluetooth SIG Appreciation AwardBluetooth Qualification Review Board
Timothy Cook
Cheng Jiang
Ryan McCord
Matthew Seabold
Chenhong Zhou
Qualcomm Technologies, Inc.Outstanding IOP Contributor Appreciation AwardElectronic Shelf Label Working Group
Ash Chen
Marie Janssen
Dayeong Lee
Benson Li
Christopher Rabasa
Christian Rollmann
Jeremy Wu
Google LLCOutstanding IOP Contributor Appreciation AwardAudio, Telephony, and Automotive Working Group
Erik Moll
Abdul Nabi 
Koninklijke Philips N.V.Outstanding IOP Contributor Appreciation AwardMedical Devices Working Group
Lauri Hintsala
Lasse Huovinen
Karoly Kovacs
Silicon LaboratoriesOutstanding IOP Contributor Appreciation AwardCore Specification Working Group
Piotr WiniarczykSilvair, Inc.Outstanding IOP Contributor Appreciation AwardMesh Working Group

Board of Directors Recognition Award for Outstanding Contribution

Recipient NameCategory Group
Leif AschehougBoard of Directors Recognition AwardRemote Testing Task Force (RTTF)
Asbjørn SæbøBoard of Directors Recognition AwardRemote Testing Task Force (RTTF)
Jonathan TannerBoard of Directors Recognition AwardRemote Testing Task Force (RTTF)
Mayank BatraBoard of Directors Recognition AwardRemote Testing Task Force (RTTF)
Simon SlupikBoard of Directors Recognition AwardRemote Testing Task Force (RTTF)
Marcel HoltmannBoard of Directors Recognition AwardRemote Testing Task Force (RTTF)
Robert HughesBoard of Directors Recognition AwardRemote Testing Task Force (RTTF)
Robert HulveyBoard of Directors Recognition AwardRemote Testing Task Force (RTTF)
Omkar KulkarniBoard of Directors Recognition AwardRemote Testing Task Force (RTTF)
Robin HeydonBoard of Directors Recognition AwardSpecification Automation Task Force (SATF)
Piotr WiniarczykBoard of Directors Recognition AwardSpecification Automation Task Force (SATF)

Bluetooth SIG appreciation – Recognition of IOP Participation

NameMember CompanySpecification
Chi KwanBroadcom CorporationCore Specification Enhancements – EAD & PAwR
Sean LinBroadcom CorporationCore Specification Enhancements – EAD & PAwR
Timothy CookQualcomm Technologies, Inc.Core Specification Enhancements – EAD & PAwR
Karoly KovacsSilicon LaboratoriesCore Specification Enhancements – EAD & PAwR
Lasse HuovinenSilicon LaboratoriesCore Specification Enhancements – EAD & PAwR
Lauri HintsalaSilicon LaboratoriesCore Specification Enhancements – EAD & PAwR
Kyle Penri-WilliamEllisysCore Specification Enhancements – EAD & PAwR
Fabien DuvouxEllisysCore Specification Enhancements – EAD & PAwR
Clement VacheronEllisysCore Specification Enhancements – EAD & PAwR
Rangineni BalasubramanyamInfineon Technologies AGCore Specification Enhancements – EAD & PAwR
Yu Chia LinInfineon Technologies AGCore Specification Enhancements – EAD & PAwR
Hassan ElmadiPacketcraft, Inc.Core Specification Enhancements – EAD & PAwR
Matthew SeaboldQualcomm Technologies, Inc.Core Specification Enhancements – EAD & PAwR
Priyanka GuptaTeledyneCore Specification Enhancements – EAD & PAwR
Dan JamesTeledyneCore Specification Enhancements – EAD & PAwR
Craig CarlsonF. Hoffmann-La Roche AGElapsed Time Service
Abdul NabiKoninklijke Philips N.V.Elapsed Time Service
Erik MollKoninklijke Philips N.V.Elapsed Time Service
Leif AschehougNordic Semiconductor ASAElapsed Time Service
Pirun LeeNordic Semiconductor ASAElectronic Shelf Label Profile & Service
Timothy CookQualcomm Technologies, Inc.Electronic Shelf Label Profile & Service
Matthew SeaboldQualcomm Technologies, Inc.Electronic Shelf Label Profile & Service
Cheng JiangQualcomm Technologies, Inc.Electronic Shelf Label Profile & Service
Ryan McCordQualcomm Technologies, IncElectronic Shelf Label Profile & Service
Chenhong ZhouQualcomm Technologies, Inc.Electronic Shelf Label Profile & Service
Karoly KovacsSilicon LaboratoriesElectronic Shelf Label Profile & Service
Tamas KraniczSilicon LaboratoriesElectronic Shelf Label Profile & Service
Craig CarlsonF. Hoffmann-La Roche AGGeneric Health Sensor Profile & Service
Abdul NabiKoninklijke Philips N.V.Generic Health Sensor Profile & Service
Erik MollKoninklijke Philips N.V.Generic Health Sensor Profile & Service
Ella ChuMicrochip Technology IncorporatedGeneric Health Sensor Profile & Service
Charlie LeeMicrochip Technology IncorporatedGeneric Health Sensor Profile & Service
Leif AschehougNordic Semiconductor ASAGeneric Health Sensor Profile & Service
Tabish RizviApple Inc.HFP Enhancement – Super Wide Band
Sherry SmithBroadcom CorporationHFP Enhancement – Super Wide Band
David HughesBroadcom CorporationHFP Enhancement – Super Wide Band
Ash ChenGoogle LLCHFP Enhancement – Super Wide Band
Benson LiGoogle LLCHFP Enhancement – Super Wide Band
Christian RollmannGoogle LLCHFP Enhancement – Super Wide Band
Christopher RabasaGoogle LLCHFP Enhancement – Super Wide Band
Jeremy WuGoogle LLCHFP Enhancement – Super Wide Band
Marie JanssenGoogle LLCHFP Enhancement – Super Wide Band
Dayeong LeeGoogle LLCHFP Enhancement – Super Wide Band
Anil Kumar VutukuruLTIMindtree HFP Enhancement – Super Wide Band
Amit PanvekarQualcomm Technologies, Inc.HFP Enhancement – Super Wide Band
Omkar KulkarniNordic Semiconductor ASAMesh NLC Profiles
Piotr WiniarczykSilvair, Inc.Mesh NLC Profiles
Recipient NameMember CompanyCategoryGroup
Koorosh AkhavanQualcomm Technologies, Inc.Outstanding New Technical ContributorCore Specification Working Group
Christof FerschDolbyOutstanding New Technical ContributorAudio, Telephony, and Automotive Working Group
Andrew EstradaSony CorporationOutstanding Technical ContributorAudio, Telephony, and Automotive Working Group
Frank BerntsenNordic Semiconductor ASAOutstanding Technical ContributorHuman Interface Device Working Group
Masahiko SekiSony CorporationOutstanding Technical ContributorGeneric Audio Working Group
Piotr WiniarczykSilvair, Inc.Outstanding Technical ContributorMesh Working Group
Clive FeatherSamsungOutstanding Technical ContributorCore Specification Working Group
Nick HunnWiFore ConsultingBluetooth SIG Appreciation AwardHearing Aid Working Group
Yao WangBarrot Technology LimitedOutstanding IOP Contributor Appreciation AwardAudio, Telephony, and Automotive Working Group
The Telink Mesh TeamTelink Semiconductor (Shanghai) Co., LtdOutstanding IOP Contributor Appreciation AwardMesh Working Group
Grzegorz Kolodziejczyk, Mariusz Skamra, Jakub Tyszkowski, Łukasz RymanowskiCodecoup Outstanding IOP Contributor Appreciation AwardHearing Aid Working Group
Sushil Deka, Shitiz Kumar, Prashant Agrawal, Parameshwar Kengond, Harish Kumar S, Tarun Goswami, Lucrezia Fanizzi, Pascal Chapelot, Stratos Chatzikyriakos, Mohammed Saleem Khan, Anantha KrishnaQualcomm Technologies, Inc. Outstanding IOP Contributor Appreciation AwardGeneric Audio Working Group
Christian-Alexander Luszick, Craig Carlson, David Sempsrott, Rick Wilson, and Robert SaboF. Hoffmann-La Roche AGOutstanding IOP Contributor Appreciation AwardMedical Devices Working Group
Frank BerntsenNordic Semiconductor ASA Outstanding IOP Contributor Appreciation AwardHuman Interface Device Working Group

Bluetooth SIG appreciation – Recognition of IOP Participation

NameMember CompanySpecification
Christian-BT LuszickF. Hoffmann-La Roche AGAuthorization Control Profile and Service
Christoph FischerF. Hoffmann-La Roche AGAuthorization Control Profile and Service
Craig CarlsonF. Hoffmann-La Roche AGAuthorization Control Profile and Service
David SempsrottF. Hoffmann-La Roche AGAuthorization Control Profile and Service
Rick WilsonF. Hoffmann-La Roche AGAuthorization Control Profile and Service
Robert SaboF. Hoffmann-La Roche AGAuthorization Control Profile and Service
Gerrit NiezenTidepool ProjectAuthorization Control Profile and Service
Nathaniel HammingTidepool ProjectAuthorization Control Profile and Service
Tapani OtalaTidepool ProjectAuthorization Control Profile and Service
Yao WangBarrot Technology LimitedBasic Audio Profile
Chaojing SunBroadcom CorporationBasic Audio Profile
Sherry SmithBroadcom CorporationBasic Audio Profile
Grzegorz KolodziejczykCodecoup sp. z o.o.Basic Audio Profile
Mariusz SkamraCodecoup sp. z o.o.Basic Audio Profile
Jakub TyszkowskiCodecoup sp. z o.o.Basic Audio Profile
Łukasz RymanowskiCodecoup sp. z o.o.Basic Audio Profile
Sreeram TatapudiInfineon Technologies AGBasic Audio Profile
Sahana DNInfineon Technologies AGBasic Audio Profile
Hardikkumar ChauhanInfineon Technologies AGBasic Audio Profile
Luiz Von DentzIntel CorporationBasic Audio Profile
Ella ChuMicrochip Technology IncorporatedBasic Audio Profile
Charlie LeeMicrochip Technology IncorporatedBasic Audio Profile
Nidhi S VenkateshMindTree LimitedBasic Audio Profile
Badrinarayanan KMindTree LimitedBasic Audio Profile
Anil VutukuruMindTree LimitedBasic Audio Profile
Harish Kumar SQualcomm Technologies, Inc.Basic Audio Profile
Hendrik CordierQualcomm Technologies, Inc.Basic Audio Profile
Nagendra VQualcomm Technologies, Inc.Basic Audio Profile
Pascal ChapelotQualcomm Technologies, Inc.Basic Audio Profile
Prashant AgrawalQualcomm Technologies, Inc.Basic Audio Profile
Sushil DekaQualcomm Technologies, Inc.Basic Audio Profile
Vasilis MichopoulosQualcomm Technologies, Inc.Basic Audio Profile
Inga StotlandIntel CorporationBattery Service 1.1
Frank BerntsenNordic Semiconductor ASABattery Service 1.1
Yao WangBarrot Technology LimitedCommon Audio Profile
Sherry SmithBroadcom CorporationCommon Audio Profile
Grzegorz KolodziejczykCodecoup sp. z o.o.Common Audio Profile
Jakub TyszkowskiCodecoup sp. z o.o.Common Audio Profile
Łukasz RymanowskiCodecoup sp. z o.o.Common Audio Profile
Hardikkumar ChauhanInfineon Technologies AGCommon Audio Profile
Nidhi S VenkateshMindTree LimitedCommon Audio Profile
Badrinarayanan KMindTree LimitedCommon Audio Profile
Anil VutukuruMindTree LimitedCommon Audio Profile
Harish Kumar SQualcomm Technologies, Inc.Common Audio Profile
Yao WangBarrot Technology LimitedHearing Access Profile and Service
Grzegorz KolodziejczykCodecoup sp. z o.o.Hearing Access Profile and Service
Mariusz SkamraCodecoup sp. z o.o.Hearing Access Profile and Service
Jakub TyszkowskiCodecoup sp. z o.o.Hearing Access Profile and Service
Łukasz RymanowskiCodecoup sp. z o.o.Hearing Access Profile and Service
Thorkild PedersenGN Hearing A/SHearing Access Profile and Service
Oktay BarisGN Hearing A/SHearing Access Profile and Service
Naveen M N Hearing Access Profile and Service
Yao WangBarrot Technology LimitedPublic Broadcast Profile
Sherry SmithBroadcom CorporationPublic Broadcast Profile
Laurent TrarieuxCEVA-RiveriawavesPublic Broadcast Profile
Grzegorz KolodziejczykCodecoup sp. z o.o.Public Broadcast Profile
Jakub TyszkowskiCodecoup sp. z o.o.Public Broadcast Profile
Łukasz RymanowskiCodecoup sp. z o.o.Public Broadcast Profile
Thorkild PedersenGN Hearing A/SPublic Broadcast Profile
Yao WangBarrot Technology LimitedTelephony and Media Audio Profile
Sherry SmithBroadcom CorporationTelephony and Media Audio Profile
Laurent TrarieuxCEVA-RiveriawavesTelephony and Media Audio Profile
Grzegorz KolodziejczykCodecoup sp. z o.o.Telephony and Media Audio Profile
Jakub TyszkowskiCodecoup sp. z o.o.Telephony and Media Audio Profile
Łukasz RymanowskiCodecoup sp. z o.o.Telephony and Media Audio Profile
Efstratios ChatzikyriakosQualcomm Technologies, Inc.Telephony and Media Audio Profile
Parameshwar KengondQualcomm Technologies, Inc.Telephony and Media Audio Profile
Prashant AgrawalQualcomm Technologies, Inc.Telephony and Media Audio Profile
Sushil DekaQualcomm Technologies, Inc.Telephony and Media Audio Profile
Michal NarajowskiCodecoup sp. z o.o.Mesh Device Firmware Update
Mesh Profile Enhancements ( CBP, ENH, EPA, PRB, SBR)
 Espressif Systems (Shanghai) Co., Ltd.Mesh Device Firmware Update
Mesh Profile Enhancements ( CBP, ENH, EPA, PRB, SBR)
Mike WengInfineon Technologies AGMesh Device Firmware Update
Mesh Profile Enhancements ( CBP, ENH, EPA, PRB, SBR)
Badrinarayanan KMindTree LimitedMesh Device Firmware Update
Mesh Profile Enhancements ( CBP, ENH, EPA, PRB, SBR)
Peter KozarSilicon LaboratoriesMesh Device Firmware Update
Mesh Profile Enhancements ( CBP, ENH, EPA, PRB, SBR)
Piotr WiniarczykSilvair, Inc.Mesh Device Firmware Update
Mesh Profile Enhancements ( CBP, ENH, EPA, PRB, SBR)
 Telink Semiconductor (Shanghai) Co., LtdMesh Device Firmware Update
Mesh Profile Enhancements ( CBP, ENH, EPA, PRB, SBR)
Recipient NameMember CompanyCategoryGroup
Sophia FeilExpleo Germany GmbHOutstanding New Technical ContributorAudio, Telephony, and Automotive Working Group
Qing AnAlibaba GroupOutstanding New Technical ContributorMesh Working Group
Andrew EstradaSony CorporationOutstanding Technical ContributorAudio, Telephony, and Automotive Working Group
Chris ChurchQualcommOutstanding Technical ContributorGeneric Audio Working Group
Angel PoloBroadcom IncorporatedOutstanding Technical ContributorCore Specification Working Group
Piotr WiniarczykSilvair, Inc.Outstanding Technical ContributorMesh Working Group
Szymon SlupikSilvair, Inc.Outstanding Technical ContributorMesh Working Group
Alicia CourtneyBroadcomBluetooth SIG appreciation – Working Group ContributorBTI & BQRB Working Group
Recipient NameMember CompanyCategoryGroup
Pouria ZandCypress Semiconductor CorporationOutstanding New Technical ContributorCore Specification Working Group
Piergiuseppe Di MarcoSilvair, Inc.Outstanding New Technical ContributorMesh Working Group
Andrew EstradaSony CorporationOutstanding Technical Contributor of the YearAudio, Telephony, and Automotive Working Group
Jori RintahakaSilicon LaboratoriesOutstanding Technical Contributor of the YearMesh Working Group
Tomas MotosTexas Instruments IncorporatedOutstanding Technical Contributor of the YearCore Specification Working Group
Chris ChurchQualcommOutstanding Technical Contributor of the YearGeneric Audio Working Group
Piotr WiniarczykSilvair, Inc.Outstanding Technical Contributor of the YearMesh Working Group
Asbjørn SaebøNordic Semiconductor ASABluetooth SIG appreciation – Working Group ContributorGeneric Audio Working Group
Recipient NameMember CompanyCategoryGroup
Mayank Batra Qualcomm Technologies, Inc.Working Group/Committee Chair of the YearCore Specification Working Group
Szymon Slupik Silvair, Inc.Working Group/Committee Chair of the YearMesh Working Group
Mesh Working Groupn/aWorking Group of the YearMesh Working Group
Danilo BlasiSTMicroelectronicsOutstanding Technical Contributor of the YearMesh Working Group
Kanji KeraiSivantos GmbHOutstanding Technical Contributor of the YearCore Specification Working Group
Ravi BamidiSilvair, Inc.Outstanding New Contributor in Bluetooth SIG GroupsMesh Working Group
Robert HughesIntel CorporationChairman’s Awardn/a
Recipient NameMember CompanyCategoryGroup
Mayank Batra QualcommWorking Group/Committee Chair of the Year Core Specification Working Group
Mesh Working Groupn/aWorking Group of the Year Award Mesh Working Group
Piotr Winiarczyk Silvair, Inc.Outstanding Technical Contributor of the Year Award Mesh Working Group
Himanshu Bhalla Intel CorporationOutstanding New Contributor to Bluetooth SIG GroupsGeneric Audio Working Group 
Felix BootzF. Hoffmann-La Roche AGKey Contributor to Reconnection Configuration Profile and ServiceMedical Devices Working Group
Harald Prinzhorn F. Hoffmann-La Roche AGKey Contributor to Insulin Delivery Profile and ServiceMedical Devices Working Group
Recipient NameMember CompanyCategoryGroup
Brian ReddingQualcommFor Outstanding Contributions to the Adoption of Bluetooth Core Specification 5 & Core Specification Supplement 7Core Specification Working Group
Clive FeatherSamsung Electronics Co., Ltd.For Outstanding Contributions to the Adoption of Bluetooth Core Specification 5 & Core Specification Supplement 7, For Outstanding Contributions to the Adoption of Bluetooth Core Specification Addendum 6 and For Outstanding Contributions to the Adoption of Errata Service Release 10 Core Specification Working Group
Gerard HarbersXicato Inc.Outstanding New Contributor in Bluetooth SIG Groups and For Outstanding Contributions to the Adoption of Mesh Device Properties 1.0 Mesh Working Group
Guillaume SchatzEM MICROELECTRONIC MARIN SAFor Outstanding Contributions to the Adoption of Fitness Machine Profile and ServiceSports & Fitness Working Group
Joel LinskyQualcommFor Outstanding Contributions to the Adoption of Bluetooth Core Specification Addendum 6 and For Outstanding Contributions to the Adoption of Bluetooth Core Specification 5 & Core Specification Supplement 7Core Specification Working Group
Leif-Alexandre AschehougNordic Semiconductor ASAFor Outstanding Contributions to the Adoption of Fitness Machine Profile and Service and For Outstanding Contributions to the Adoption of GATT Specification SupplementSports & Fitness Working Group
Michael UngstrupWidex A/SOutstanding New Contributor in Bluetooth SIG GroupsHearing Aid Working Group
Olivia Bellamou-HuetAssystemFor Outstanding Contributions to the Adoption of Message Access Profile 1.4 Audio, Telephony, and Automotive Working Group
Piotr Winiarczyk Silvair, Inc.For Outstanding Contributions to the Adoption of Mesh Profile Specification 1.0 and For Outstanding Contributions to the Adoption of Mesh Model Specification 1.0Mesh Working Group and Architectural Review Board
Robert HughesIntel CorporationFor Outstanding Contributions to the Adoption of Mesh Profile Specification 1.0Mesh Working Group
Robin HeydonQualcommFor Outstanding Contributions to the Adoption of Mesh Profile Specification 1.0 and For Outstanding Contributions to the Adoption of Mesh Device Properties 1.0 Mesh Working Group and Architectural Review Board
Szymon Slupik Silvair, Inc.Working Group/Committee Chair of the Year, Working Group of the Year Award, Outstanding Technical Contributor of the Year Award and For Outstanding Contributions to the Adoption of Mesh Model Specification 1.0Mesh Working Group
Tomas MotosTexas Instruments IncorporatedFor Outstanding Contributions to the Adoption of Bluetooth Core Specification 5 & Core Specification Supplement 7 Core Specification Working Group
Recipient NameMember CompanyCategoryGroup
Mesh Working Group (Szymon and Bob)Working Group of the YearMesh Working Group
Robert HughesIntel CorporationWorking Group/Committee Chair of the YearMesh Working Group
Brian ReddingQualcommOutstanding Technical Contributor of the Year  Core Specification Working Group
Szymon Slupik Seed Labs Inc.Outstanding Technical Contributor of the Year Mesh Working Group
Olivia Bellamou-HuetBerner & Mattner Systemtechnik GmbHOutstanding New Contributor in Bluetooth SIG GroupsAudio, Telephony and Automotive & Sports and Fitness Working Groups
Sam GeeraertsNXP SemiconductorsOutstanding New Contributor in Bluetooth SIG GroupsCore Specification Working Group
Joel LinskyQualcommFor Outstanding Contributions to the Adoption of Core Specification Addendum 5Core Specification Working Group
Robert Hughes  Intel CorporationFor Outstanding Contributions to the Adoption of Transport Discovery Service Discovery of Things Working Group
Jingu Choi LG Electronics Inc.For Outstanding Contributions to the Adoption of ​Transport Discovery Service Discovery of Things Working Group
Chris ChurchQualcommFor Outstanding Contributions to the Adoption of ​Transport Discovery Service Discovery of Things Working Group
Casper Bonde Samsung Electronics Co., Ltd.For Outstanding Contributions to the Adoption of ​Message Access Profile 1.3Audio, Telephony and Automotive Working Group
Dominik Sollfrank Berner & Mattner Systemtechnik GmbHFor Outstanding Contributions to the Adoption of ​Message Access Profile 1.3Audio, Telephony and Automotive Working Group
Guillaume SchatzPolar Electro OyFor Outstanding Contributions to the Adoption of ​Cycling Power Profile & Service 1.1Sports and Fitness Working Group
Laurence RichardsonQualcommFor Outstanding Contributions to the Adoption of ​Object Transfer Profile & ServiceSports and Fitness Working Group
Guillaume SchatzPolar Electro OyFor Outstanding Contributions to the Adoption of ​Object Transfer Profile & ServiceSports and Fitness Working Group
Robert HughesIntel CorporationFor Outstanding Contributions to the Adoption of ​Object Transfer Profile & ServiceSports and Fitness Working Group
Leif-Alexandre AschehougNordic Semiconductor ASAFor Outstanding Contributions to the Adoption of ​Object Transfer Profile & ServiceSports and Fitness Working Group