Embedded Innovation Week Winter 2021

Creating A Better Industrial Experience with Bluetooth® Technology in an Open Platform

Free Registration Linked Here

Date and Time: 26 January, 11:15-11:30am EST

Presenter: Ann Marie Olivo-Shaw, Marketing Director, North America, Tuya 


With the development of the industrial IoT market, the adoption and deployment base of Bluetooth technology has risen to an unprecedented height. With long-range capabilities and increased ease of pairing and discovery, Bluetooth technology is an excellent choice for many industrial IoT applications. In this presentation, we discuss how Bluetooth technology can be applied and deployed in an open platform on a large scale, and how Bluetooth technology can become a new link between IoT devices.

Panel: Next-Gen Wireless Comes to the Factory Floor

Date and Time: 26 January, 11:45am-12:30pm EST

Panelist: Jim Katsandres, Director of Developer Relations, Bluetooth SIG


The extended capabilities of Bluetooth technology, the proliferation of Wi-Fi 6 devices, the continued rollout of 5G networks, and the growing number of industrial IoT implementations, are big factors in the transition from wired to wireless on the factory floor. This panel will examine the evolving landscape of wireless communications technologies and some of the newest applications for industrial automation.

Related Resources:

IoT Connectivity Resource Center

About the Conference: 

Together with Fierce Electronics, Embedded Technologies Expo & Conference is excited to announce the second online Embedded Innovation Week. Through a series of live video round tables, fireside chats, tech talks, and keynotes featuring subject matter experts, attendees will be able to access top notch education, without having to travel! With topics ranging from Embedded Systems at the Edge, Industrial IoT, and Embedded Vision, it’s a must attend for engineers who are looking to get a competitive edge on all of the latest trends and technology that are impacting our industry and the world today.