LE Audio Specifications

A New Architecture for the Next Generation of Bluetooth^® Audio

LE Audio introduces an entirely new architecture for supporting audio applications using Bluetooth technology and sets the stage for the next 20 years of innovation in wireless audio. This page provides an overview of the Bluetooth Specifications that define LE Audio.

Download the Graphic

The Bluetooth Specifications that define LE Audio

Specification		Description
Bluetooth Core Specification		The Bluetooth Core Specification was enhanced in December 2019 to enable delivery of audio over Bluetooth LE, including a new LE Isochronous Channels feature.
LC3: Low Complexity Communications Codec		A new specification released in September 2020 that defines a high-quality, low-power audio codec.
Generic Audio Framework Specifications		A set of new specifications that define a flexible middleware for transmitting and controlling audio over Bluetooth LE.
	Stream Management BAP: Basic Audio Profile PACS: Published Audio Capabilities Service ASCS: Audio Stream Control Service BASS: Broadcast Audio Scan Service	A set of new specifications that define basic interoperability for audio devices, including capability discovery and configuration of unicast and broadcast audio streams.
	Media Control MCP: Media Control Profile MCS: Media Control Service	A set of new specifications that define media control.
	Call Control CCP: Call Control Profile TBS: Telephone Bearer Service	A set of new specifications that define call control for all types of telephony.
	Common Audio CAP: Common Audio Profile CAS: Common Audio Service	A set of new specifications that defines the application of isochronous audio streams with multiple devices in multi-service situations, along with the integration of media and volume controls.
	Coordinated Devices CSIP: Coordinated Set Identification Profile CSIS: Coordinated Set Identification Service	A set of new specifications that define how to identify and treat devices as part of a coordinated set. (e.g., true wireless earbuds, home stereo speakers).
	Microphone Control MICP: Microphone Control Profile MICS: Microphone Control Service	A set of new specifications that define microphone control.
	Volume Control VCP: Volume Control Profile VCS: Volume Control Service VOCS: Volume Offset Control Service AICS: Audio Input Control Service	A set of new specifications that define volume control and balance.
Use Case Profiles		A set of new specifications that define interoperable support for existing and new audio use cases based on LE Audio.
	TMAP: Telephony and Media Audio Profile	A new specification that defines global, interoperable support for telephony and media audio, replicating and extending the two primary use cases for Bluetooth Classic Audio today.
	HAP: Hearing Access Profile HAS: Hearing Access Service	A new set of specifications that define global, interoperable support for Bluetooth audio on hearing assistance devices such as hearing aids and associated hearing reinforcement solutions.
	PBP: Public Broadcast Profile	A new specification that defines global, interoperable support for broadcast audio use cases such as public address systems and televisions.

LE Audio Specification Participants

We are grateful for all the time and energy you dedicated to the LE Audio Specification Project. Your participation and collaboration are greatly appreciated, and your hard work will have a big impact on wireless audio for decades to come.

Adrian Tomasek
Fraunhofer IIS

Ahmed Shawky
Synopsys, Inc.

Akio Tanaka
Sony Corporation

Alex Volkov
Starkey Hearing Technologies

Alexander Tschekalinskij
Fraunhofer IIS

Andrew Credland
Samsung Electronics Co., Ltd

Andrew Estrada
Sony Corporation

Angel Polo
Broadcom Corporation

Anil Kumar Vutukuru
MindTree Limited

Asbjørn Sæbø
Nordic Semiconductor ASA

Balvinder Pal Singh
Intel Corporation

Bjarne Klemmensen
Demant A/S
Oticon A/S

Brian Redding
Qualcomm, Inc.

Charlie Lee
Microchip

Charlie Lenahan
Cloud2GND

Chethan Narayan Tumkur
Intel Corporation

Chris Church
Qualcomm, Inc.

Chris Deck
ON Semiconductor

Chris White
Dolby Labs
Dolby Laboratories, Inc.

Clive D. W. Feather
Samsung Cambridge Solution Centre

Daniel Ryan
Nordic Semiconductor ASA

Daniel Sisolak
Bose Corporation

David Hughes
Broadcom

Dong Jianli
Oppo

Eivind Sjøgren Olsen
Nordic Semiconductor ASA

Ella Chu
Microchip

Emmanuel Ravelli
Fraunhofer IIS

Erwin Weinans
Plantronics Inc.

Ethan Duni
Apple Inc.

Florian Lefeuvre
Texas Instruments Incorporated

Frank Yerrace
Microsoft Corporation

Frederic Belouin
RivieraWaves

Georg Dickmann
Sonova AG

Grzegorz Kołodziejczyk
Codecoup

Håkon Amundsen
Nordic Semiconductor ASA

Harish Balasubramaniam
Intel Corporation

Harpreet Narula
Cirrus Logic

Haruhiko Kaneko
Sony Corporation

Hidetoshi Kurihara
Sony Corporation

Himanshu Bhalla
Intel Corporation

HJ Lee
LG Electronics, Inc.

Jan Büthe
Fraunhofer IIS

Jannik Andersen
Widex A/S

Jason Hillyard
ARM Ltd
Packetcraft, Inc.

Jean-Philippe Lambert
RivieraWaves

Jeff Solum
Starkey Hearing Technologies

Jiawei Chen
ARM Ltd

Jim Ryan
ON Semiconductor

Jin-Kwon Lim
LG Electronics

Joel Linsky
Qualcomm, Inc.

Joerg Lebender
Sivantos GmbH

John Yi
ARM Ltd
Packetcraft, Inc.

Jonas Svedberg
Ericsson AB

Jonathan Tanner
Qualcomm, Inc.

Kanji Kerai
Widex A/S
WS Audiology
WS Audiology Denmark A/S
Meta Platforms, Inc.

Karim Mokhtar
Synopsys, Inc.

Khaled Ali
Synopsys, Inc.

Khaled Elsayed
Synopsys, Inc.

L.C. Ko
MediaTek

Latifa Ali
Synopsys, Inc.

Leif-Alexandre Aschehoug
Nordic Semiconductor ASA

Liu Huazhang
Hisilicon Technologies Co., Ltd.

Luiz Von Dentz
Intel Corporation

Łukasz Rymanowski
Codecoup

Magnus Eriksson
Intel Corporation

Mahmoud Samy
Synopsys, Inc.

Marcel Holtmann
Intel Corporation

Marcel Vlaming
GN Hearing A/S

Markus Schnell
Fraunhofer IIS

Martin Sehlstedt
Ericsson AB

Masahiko Seki
Sony Corporation

Masahiro Shimizu
Sony Corporation

Maximilian Schlegel
Fraunhofer IIS

Mayank Batra
Qualcomm, Inc.

Michael Rougeux
Bose Corporation

Michael Ungstrup
Widex A/S

Mohan Mysore
Cypress Semiconductor Corporation

Morteza Rahchamani
ARM Ltd.

Nick D’Amato
Sonos

Nick Hunn
GN Hearing A/S
GN Resound

Niel Warren
Google

Ole Heftholm-Jensen
Samsung Electronics Co., Ltd.

Oren Haggai
Intel Corporation

Pål Håland
Nordic Semiconductor ASA

Peter Kroon
Intel Corporation

Peter Liu
Bose Corporation
Google

Qiang Li
Barrot Technology Limited

Rangineni Balasubramanyam
Cypress Semiconductor Corporation

Rasmus Abildgren
Bose Corporation
Samsung Electronics Co., Ltd.

Riccardo Cavallari
Sivantos GmbH
WS Audiology Denmark A/S

Robert Bäuml
Sivantos GmbH

Robert D Hughes
Intel Corporation

Robin Heydon
Qualcomm, Inc.

Rohit Gupta
Cypress Semiconductor Corporation

Sachinakumar Hottigoudar
Cypress Semiconductor Corporation

Sam Geeraerts
NXP Semiconductors

Scott Walsh
Plantronics, Inc., Poly

Shawn Ding
Broadcom Corporation

Sherry Smith
Broadcom Corporation

Shwetha Mahadik
Mindtree

Siegfried Lehmann
Apple, Inc.

Simon Jonghun Song
LG Electronics, Inc.

Søren Larsen
Widex A/S

Stefan Mijovic
Sivantos GmbH

Stephan Gehring
Sonova AG

Taeyoung Song
LG Electronics

Thorkild Pedersen
GN Hearing A/S

Tim Reilly
Bose Corporation

Tomas Frankkila
Ericsson AB

Tony Branch
T2labs-LLC

Xuemei Ouyang, Xuemei Sherry Ouyang
Intel Corporation

Yao Wang
Barrot Technology Limited

LE Audio IOP Participants

Yao Wang
Barrot

Satya Calloji
Broadcom Corporation

Jean Lee
Broadcom Corporation

Caper Bonde
Bose

David Hughes
Broadcom Corporation

Sherry Smith
Broadcom Corporation

Chaojing Sun
Broadcom Corporation

Grzegorz Kolodziejczyk
Codecoup sp. z o.o.

Szymon Czapracki
Codecoup sp. z o.o.

Mariusz Skamra
Codecoup sp. z o.o.

Jakub Tyszkowski
Codecoup sp. z o.o. sp. k.

Thorkild Pedersen
GN Hearing A/S

Oktay Baris
GN Hearing A/S

Bihang Ni
GN Hearing A/S

Sreeram Tatapudi
Infineon Technologies AG

Sahana DN
Infineon Technologies AG

Hardikkumar Chauhan
Infineon Technologies AG

Luiz Von Dentz
Intel

Balvinder pal Singh
Intel

Nadav Shmueli
Intel

Tedd An
Intel

Anandhakumar Chettiannan
Intel

Vladislav Tsigan
Intel

Srinivas Krovvidi
Intel

Oren Haggai
Intel

Ella Chu
Microchip

Charlie Lee
Microchip

Naveen M

Nidhi Venkatesh
MindTree Limited

Sam Geeraerts
NXP

Parameshwar Kengond
Qualcomm, Inc.

Efstratios Chatzikyriakos
Qualcomm, Inc.

Prashant Agrawal
Qualcomm, Inc.

Pascal Chapelot
Qualcomm, Inc.

Hendrik Cordier
Qualcomm, Inc.

Sushil Deka
Qualcomm, Inc.

Lucrezia Fanizzi
Qualcomm, Inc.

Neil Hodgson
Qualcomm, Inc.

Harish Kumar
Qualcomm, Inc.

Shitiz Kumar
Qualcomm, Inc.

Gavin Meakes
Qualcomm, Inc.

Vasilis Michopoulos
Qualcomm, Inc.

Anantha Krishna
Qualcomm, Inc.

Tarun Goswami
Qualcomm, Inc.

Mohammed Saleem Khan
Qualcomm, Inc.

Kameshwar Singh
Qualcomm, Inc.

Nagendra V
Qualcomm, Inc.

Anand Noubade
Qualcomm, Inc.

Yujuan Lyu
Realsil

Gu Qing
Realsil

Laurent Trarieux
CEVA – RivieraWaves

Łukasz Rymanowski
Codecoup sp. z o.o.

Badrinarayanan K
MindTree Limited

Anil Vutukuru
MindTree Limited

Related Resources

Blog Post

New Forecasts Highlight the Future of the Wireless Audio Market

Since its inception, audio has represented the largest solution area for Bluetooth^® technology, and…

Video

Upgrade Wireless Mic System To Support Auracast™ Via VOCE

Want to upgrade your wireless microphone system to support Auracast™? As long as there…

Watch Now

SIG Member

Blog Post

New Market Opportunities Enabled by Auracast™ Broadcast Audio

The arrival of LE Audio is set to transform the Bluetooth^® audio ecosystem over…

Video

LE Audio: The Future Of Wireless Sound

Introducing LE Audio: a new standard for Bluetooth technology on Galaxy devices. LE audio…

Watch Now

SIG Member

Blog Post

Explained: How to Join an Auracast™ Broadcast

Recently, Chuck Sabin, senior director of market development at the Bluetooth Special Interest Group…

Report

LE Audio: The Future of Bluetooth^® Audio

ABI Research outlines how the arrival of LE Audio is set to transform the Bluetooth audio ecosystem and the impact it will have on Bluetooth^{^®} audio market forecasts.

Learn More