embedded world North America 2026
Embedded world North America is the premier trade show and conference dedicated to the embedded systems ecosystem. This event brings together design engineers, systems architects, firmware developers, and product leaders to explore the latest technologies, tools, and methodologies shaping the future of embedded innovation.
The Bluetooth SIG will have a special session within the conference focusing on recent enhancements and emerging technologies that are paving the way for the next generation of Bluetooth innovation.
Bluetooth session overview
Modular architecture for enhanced vehicle access with Bluetooth® Channel Sounding
Presenter: Santiago Garcia | NXP
[Session description coming soon]
Bluetooth Mesh / NLC: The highly scalable data fabric for smart buildings
Presenter: Simon Slupik | Silvair
[Session description coming soon]
Seamless handover of Bluetooth® LE connections for enhanced vehicle access user experience
Presenter: Evan Wakefield | TI
[Session description coming soon]
Examining key emerging technologies in the Bluetooth® roadmap
Presenter: Alfredo Perez | Bluetooth SIG
[Session description coming soon]
Advanced RF front-end IC and antenna technologies for Bluetooth® LE based Ultra Low-Power wireless connectivity for AIoT
Presenter: Yongxi Qian | BHW Technologies
[Session description coming soon]
GATT or L2CAP Choosing Your Bluetooth® LE transport
Presenter: Jonathan Sharp | Nordic Semiconductor
[Session description coming soon]
