Bluetooth APAC seminar series 2026: Taipei

The 2026 Bluetooth APAC seminar series: Taipei brings together Bluetooth SIG representatives and member company speakers to share the latest Bluetooth technology advancements and market trends and explore new application opportunities across key industries. The seminar will feature two sessions.

Morning: An introduction to Bluetooth® High Data Throughput (HDT), which raises the maximum Bluetooth Low Energy bit rate from 2 Mbps to 7.5 Mbps—nearly four times faster. HDT also improves capacity, energy efficiency, and reliability, enhancing existing applications and enabling new use cases such as high-resolution lossless audio.

Afternoon: Insights from two new Bluetooth® market blueprints – automotive and healthcare over the next five to seven years, and how these market needs will help shape the long-term Bluetooth technology roadmap.

Representatives from Ceva, EM Microelectronic, Intel, Nordic, NXP confirmed to present at the seminar.